전체 프로그램의 시간과 장소를 한눈에 볼 수 있는 파일을 아래에서 다운받으실 수 있습니다.
▶ Program Schedule & Space Guide
Contact
- 프로그램팀
- Tel: 02-531-7832
- Email: [email protected]
Subsessions
오전 9:00
Advanced Semiconductor Packaging Technology : Overview
Prof. Hak-Sung Kim
Hanyang University
오전 9:00 - 오전 10:15
ALD Fundamentals and Recent Advances: From Precursors to Equipment
Prof. Won-Jun Lee
Sejong University
오전 9:00 - 오전 10:15
Fundamentals of Plasma Etching
Prof. Geun Young Yeom
Sungkyunkwan University
오전 9:00 - 오전 10:15
오전 9:30
Open Remark (GES key takeaway- Call to Action)
Decarbonization as a Shared Strategic Priority for the Semiconductor Supply Chain
Saifi Usmani
SEMI
오전 9:30 - 오전 9:40
오전 9:40
오전 9:50
오전 9:55
SCC Baseline Ambition Roadmap (BAR) WG
Developing science-aligned emissions reduction targets for the semiconductor industry
Prannoy Chowdhury
Carbon Trust
오전 9:55 - 오전 10:15
오전 10:00
CMP – The Hidden Architect in the Advanced Packaging Era
Kevin Vandersmissen (invited)
imec
오전 10:00 - 오전 10:40
Development Status and Future Prospects of Lithography Equipment
Hyoung-Kook Kim
ASML
오전 10:00 - 오전 10:50
Emergence and Evolution of Advanced Package Materials
Jihye Shim
Samsung Electronics
오전 10:00 - 오전 10:30
오전 10:05
[Keynote] Physical AI for Dark Factories: Sim-to-Real Orchestration of Heterogeneous Robot Fleets Using Digital Twin Intelligence
Prof. Young Jae Jang (invited)
KAIST
오전 10:05 - 오전 10:40
오전 10:15
오전 10:20
Beyond ZFLOPS: What's Next?
Architecting the Future of AI Systems
Jaihyuk Song
Samsung Electronics
오전 10:20 - 오전 10:40
오전 10:25
1000x More Efficient On-Device AI: Powering AR/VR, Humanoid Robotics, and Beyond
Jaejun Lee
AnalogAI
오전 10:25 - 오전 10:35
오전 10:30
Advanced Semiconductor Packaging Technology : Recent Trends
JaeDong Kim
JD Technology
오전 10:30 - 오전 11:45
Epitaxy Engineering in Advanced Semiconductor Devices
Prof. Dae-Hong Ko
Yonsei University
오전 10:30 - 오전 11:45
Overview of Emerging Memory Technologies for Next-Generation Computing
Soo Gil Kim
SK hynix
오전 10:30 - 오전 11:00
Various Reliability Issues in DRAM cell transistors
Junsoo Kim
Samsung Electronics
오전 10:30 - 오전 11:45
오전 10:35
From Data Gravity to Data-Centric Intelligence: Redefining the Future of AI Infrastructure
Jin Kim
XCENA
오전 10:35 - 오전 10:45
오전 10:40
[Keynote] Advancing Autonomous Fabs: PM Automation & Standardization Strategy
Youbean Kim (invited)
Myongji University
오전 10:40 - 오전 11:15
오전 10:45
오전 10:50
오전 10:55
Ease on Three-Dimensional Memory and Logic Integration
Jekyung Kim
FS2
오전 10:55 - 오전 11:05
오전 11:00
Big Chips, Tiny Chips, and Scaling 3-D System Architectures: A Hybrid Bonding Perspective
Seung Kang
Adeia
오전 11:00 - 오전 11:30
Building Scalable Infrastructure for the AI Factories of Tomorrow: Cadence’s End-to-end Approach
Boyd Phelps
Cadence Design Systems
오전 11:00 - 오전 11:20
Scope 3 Decarbonization
Collaboration and Partnership across the Value Chain
In San Park
SK Siltron
오전 11:00 - 오전 11:15
오전 11:15
Advanced Liquid Cooling Solution for Next Generation AI Semiconductor
Yunhyeok Im
KoolMicro
오전 11:15 - 오전 11:25
Considerations for Realizing Autonomous Manufacturing by AX
KyeungTai Kim
Miracom
오전 11:15 - 오전 11:40
Proactive Yield Maximization in Photolithography via Human-in-the-Loop AI on an On-Premise Big Data Platform
Jeng-Hun Suh
SemiAI
오전 11:15 - 오전 11:40
Surface Preparation Challenges in 3D Integration
Philippe Garnier (invited)
STMicroelectronics
오전 11:15 - 오전 11:55
오전 11:20
오전 11:25
오전 11:30
오전 11:35
오전 11:40
Renewable Energy Procurement Guideline in the Korea market
Jeongseok Lee
Korea Energy Agency
오전 11:40 - 오후 1:10
The Inflection Point has arrived: Driving Innovation towards Future of Memory Technology
Sunghoon Lee
SK hynix
오전 11:40 - 오후 12:00
오전 11:45
오전 11:50
오전 11:55
오후 12:00
오후 12:05
오후 12:15
오후 12:20
Overview of Market Trends in the Semiconductor Materials Industry with Focus on CMP Consumables
Andy Tuan
Linx Consulting Inc. / SEMI
오후 12:20 - 오후 12:45
오후 12:25
Autonomous Process Control for Advanced Semiconductor Fabs
Seungchoun Choi
Amously
오후 12:25 - 오후 12:35
오후 12:35
오후 12:55
Robust O/L Control Limitations Imposed by the CMP Process
Hyeokjung Lee
SK hynix
오후 12:55 - 오후 1:20
오후 1:00
Advanced embedded memory technology for generative AI development at the edge
Gouri Sankar Kar (invited)
imec
오후 1:00 - 오후 1:40
Future Advanced Package Solutions for HPC/AI Applications
Hyun Chul Jung
Samsung Electronics
오후 1:00 - 오후 1:25
High-NA EUV Lithography at the Turning Point: Preparing for Industry Insertion
Geert Vandenberghe
imec
오후 1:00 - 오후 1:40
SiC and GaN Devices in the Mainstream - Achievements, Challenges and Perspectives
Prof. Nando Kaminski (invited)
University of Bremen
오후 1:00 - 오후 1:40
Transformational Plasma Etch Technologies Enabling Ultra Fine Pitch Patterning
Gowri Kamarthy
Lam Research
오후 1:00 - 오후 1:25
오후 1:05
Breaking Barriers, Building Careers: A Woman in Semiconductors
Gwen Lee
Lam Research
오후 1:05 - 오후 1:20
오후 1:10
Renewable Energy Procurement and Supply Chain Management through Digital Marketplace
Mingi Lim
CnerG
오후 1:10 - 오후 1:25
오후 1:20
오후 1:25
Complex Memory Systems for the Agentic AI Era: HBM-HBF-SOCAMM
Prof. Joungho Kim
KAIST
오후 1:25 - 오후 1:50
Velocity and Precision Advancing Plasma Etching for AI-Driven Scaling
Sang-Jun Choi
Applied Materials
오후 1:25 - 오후 1:50
VFO Packaging for High Performance On-Device AI systems
Ki Jun Sung
SK hynix
오후 1:25 - 오후 1:50
오후 1:30
Advanced Packaging as a Platform: Enabling the Future Architecture of Semiconductors
Jan Vardaman
TechSearch International
오후 1:30 - 오후 2:00
From Reactive to Predictive: AI-Driven Optimization for Automated Test Equipment (ATE) Performance and Reliability
Wai-Kong Chen
Cohu
오후 1:30 - 오후 2:00
Manufacturing AI Solutions for Engineering Automation
Ki Chul Yang
BISTelligence
오후 1:30 - 오후 1:55
The Reduction of Surface Defect of SiC Epitaxy by Improved in-situ Etching Process
Han Seok Seo
Research Institute of Industrial Science & Technology
오후 1:30 - 오후 2:00
오후 1:35
오후 1:40
Innovative Techniques for High NA EUV: Achieving Robustness in Patterning
Hongik Kim
SK hynix
오후 1:40 - 오후 2:05
Next-Generation 3D-NAND Device and Process Technology
Yoohyun Noh
SK hynix
오후 1:40 - 오후 2:05
오후 1:50
Enabling 3D-IC and Advanced Packaging through Plasma Dry Etch Technologies
Jeongsoo Kim (Invited)
imec
오후 1:50 - 오후 2:30
From Silicon to Systems: Advanced Packaging enabling AI Performance Scaling
Audrey Charles (invited)
Lam Research
오후 1:50 - 오후 2:20
Prospect of Memory Devices in AI Generation
Sun-Ghil Lee
Tokyo Electron Korea
오후 1:50 - 오후 2:15
오후 1:55
오후 2:00
8 inch SiC Epitaxial Technology and Industrial Application
Larkin Kong
Hangzhou Haiqian Semiconductor
오후 2:00 - 오후 2:30
AI Propels Semiconductor Industry – What Lies Ahead
Gaurav Gupta
Gartner
오후 2:00 - 오후 2:30
AI-powered paradigm shift: Unlocking the Next Wave of Innovation in the Semiconductor Industry
Changho Jin
SK Encore
오후 2:00 - 오후 2:30
Applications of High Speed IR and Micro-Bump Metrology for Advanced Packaging of Advanced Memory and Logic Devices
Yu Figer
Onto Innovation
오후 2:00 - 오후 2:30
CMP Fundamentals for 3D Integration
Prof. Taesung Kim
Sungkyunkwan University
오후 2:00 - 오후 3:15
Regulatory Response Strategies from the Viewpoint of Customer Needs
Hyuk Hwa Kwon
SK hynix
오후 2:00 - 오후 2:25
[Session 1: Semiconductor Ecosystem in the Netherlands and Korea] Opening & Greeting
오후 2:00 - 오후 2:05
오후 2:05
Market Overview and U.S. Investment Climate
Donghwan Lee
Boston Consulting Group
오후 2:05 - 오후 2:35
[Keynote] Proactive Security Response: Mitigating Supply Chain Security Risks through Practical Drills
Yongpil Lee
Korea Internet & Security Agency (KISA)
오후 2:05 - 오후 2:30
[Session 1: Semiconductor Ecosystem in the Netherlands and Korea] Congratulatory Remark
Aukje de Vries
Minister for Foreign Trade and Development
Jong Myeong Lee
Samsung Electronics
오후 2:05 - 오후 2:10
오후 2:10
오후 2:15
오후 2:20
Intelligent ALD—Real-Time Prediction, Anomaly Detection, and Recipe Optimization
Jeff Kim
SurplusGLOBAL
오후 2:20 - 오후 2:45
MPDU (Modular Power Delivery Unit) – Intel System Level Test Platform Power Delivery Solution tailored for Manufacturing Test Environment
Syed Hussein SYED ALWI
Intel
오후 2:20 - 오후 2:50
[Session 1: Semiconductor Ecosystem in the Netherlands and Korea] Status of Korea Semiconductor Industry
Jaemin Jun
Korea Semiconductor Industry Association
오후 2:20 - 오후 2:30
오후 2:25
Accelerating Semiconductor Roadmaps: The Role of AI-Driven
Ron Pearlstein
Merck
오후 2:25 - 오후 2:50
Embedded Memory for Future Edge Computing
François Andrieu (invited)
CEA-Leti
오후 2:25 - 오후 3:05
The Evolution of EUV Resists and Semiconductor Scaling: A Technical Retrospective and Future Outlook
Ken Maruyama
JSR Corporation
오후 2:25 - 오후 2:50
오후 2:30
Current Status of Ga₂O₃ Single Crystal Growth Technology for Next-Generation Power Semiconductor Applications
Jinki Kang
AXEL
오후 2:30 - 오후 3:00
Nano Topography Technologies for the Mass Production of Hybrid Bonding Process
Joonho You
Nexensor
오후 2:30 - 오후 3:00
[Keynote] Supply Chain Integrity: A Fabless Manufacturing Perspective
Dan O'Loughlin
Qualcomm
오후 2:30 - 오후 2:55
오후 2:35
오후 2:40
오후 2:45
오후 2:50
Architecting Epitaxial Precision for Advanced Node Scaling
Yi-Chiau Huang
Applied Materials
오후 2:50 - 오후 3:15
Design-Aware Post-Si Data Analysis Methodology: Links with DFT Design, ATE Test and FA works
Jeongsu Park
Synopsys
오후 2:50 - 오후 3:20
Domain Knowledge-Driven Fusion Machine Learning for Overlay Prediction Enhancement
Taekwon Jee
SemiAI
오후 2:50 - 오후 3:15
Memory Reimagined: From High-Bandwidth to In-Memory Processing
Kyomin Sohn
Samsung Electronics
오후 2:50 - 오후 3:15
Next-Generation Etch Chemistry for the AI Era: Performance & Sustainability Enabled by Merck’s End-to-End Innovation
Sung-Ho Kim
Merck
오후 2:50 - 오후 3:15
The AI Data Center Boom: Facts, Fundamentals, and Implications for the Semiconductor Industry
Donghwan Lee
Boston Consulting Group
오후 2:50 - 오후 3:20
오후 2:55
Ohio's Burgeoning Semiconductor & Microelectronics Ecosystem
Justin Kocher
JobsOhio
오후 2:55 - 오후 3:05
Semiconductor Manufacturing Cybersecurity Consortium (SMCC) Overview
Kimberly Daich
PDF Solutions
오후 2:55 - 오후 3:20
[Session 2: EUV Technologies and Metrology] Developing EUV Mask Metrology for High-Volume Manufacturing
Byung Gook Kim
ESOL
오후 2:55 - 오후 3:05
오후 3:00
오후 3:05
3D NAND Flash Evolution: Challenges and Opportunities for the Future
Sangyong Park
Samsung Electronics
오후 3:05 - 오후 3:35
AI-Empowered Digital Twin for Multi-FAB Simulation
Prof. Sang Chul Park (invited)
Ajou University
오후 3:05 - 오후 3:30
New Jersey at the Forefront of Innovation
Bill Noonan (video recording)
Choose New Jersey
오후 3:05 - 오후 3:15
[Session 2: EUV Technologies and Metrology] Semiconductor / EUV Lithography and Related MI technology, Synchrotron Science
Sangsul Lee
Postech/Xavis Optics
오후 3:05 - 오후 3:15
오후 3:10
Advanced Packaging Market & Technology Trends - Focus on Glass
Bilal Hachemi (video recording)
Yole Group
오후 3:10 - 오후 3:35
High Power Semiconductor Markets and Evaluation Method
Hyemin Kang
Korea Institute of Energy Technology(KENTECH)
오후 3:10 - 오후 3:40
오후 3:15
Applications of Ion Implantation Technology for Scaling Down Advanced Devices
KyungWon Lee
Axcelis Technologies
오후 3:15 - 오후 3:40
Environmentally Sustainable Plasma Etching of SiO2 using Fluorinated Ethers with Low Global Warming Potentials
Prof. Chang-Koo Kim (invited)
Ajou University
오후 3:15 - 오후 3:45
High Throughput Digital Lithography Development Enables AI and HPC Device Integration
Ksenija Varga
EV Group
오후 3:15 - 오후 3:40
Tennessee’s Semiconductor Supply Chain Advantage
Hee-jung Shin
State of Tennessee Korea Office
오후 3:15 - 오후 3:25
The Role of Semiconductor Packaging in the AI Era: Innovations in Advanced Packaging Technologies Accelerating the AI Era
Kangwook Lee
SK hynix
오후 3:15 - 오후 3:40
오후 3:20
SEMI Market Outlook - Semiconductor Equipment Forecasts, Fab Investment and Material Market Outlook
Clark Tseng
SEMI
오후 3:20 - 오후 3:50
SMCC WG9: Expanding Cybersecurity Collaboration in South Korea & Standardized Semiconductor Cyber Assessment (SSCA): A Unified Approach to Supply Chain Security
Suk Won Kang
Applied Materials
오후 3:20 - 오후 3:45
오후 3:25
오후 3:30
Run-to-Run Control Automation in CMP Enabled by a Production-Oriented Digital Twin
Seungchoun Choi
Amously
오후 3:30 - 오후 3:55
Understanding of Particle Removal and Surface Preparation for 3D Integration Era
Prof. Tae-Gon Kim
Hanyang University
오후 3:30 - 오후 4:45
[Session 3: Material & Equipment Development] Opportunities for Cooperation in the SoBuJang Field of Semiconductors
Hakkyung Sung
SoBuJang Technology Collaboration Forum
오후 3:30 - 오후 3:40
오후 3:35
Atomic Layer Deposition Processes for Future Extremely Scaled Semiconductor Devices
Chang-Yong Nam (invited)
Brookhaven National Laboratory
오후 3:35 - 오후 4:15
Challenges of Energy Policy in Korea from the Perspective of Industrial Competitiveness
Prof. Sangjun Lee
Seoul National University of Science and Technology
오후 3:35 - 오후 4:00
오후 3:40
Accurate Transient Current Measurement for AI Processor Power Characterization
Justin(Jeong-Tae) Kim
Keysight Technologies
오후 3:40 - 오전 4:10
[Session 3: Material & Equipment Development] Introduction of LGE PRI (Semiconductor Equipment)
Joo Won Lee
LG Electronics PRI
오후 3:40 - 오후 3:50
오후 3:45
오후 3:50
Advanced Optical Metrology Solutions for AI Packaging Processes
Fabian Schneider
Nova
오후 3:50 - 오후 4:20
[Panel Discussion] Current Status and Outlook of AI and AI Semiconductor Technologies
Moderator: Prof. Wooyeong Cho | KAIST
Prof. Hoi-Jun Yoo
KAIST
Prof. Joungho Kim
KAIST
Sun-Ghil Lee
Tokyo Electron Korea
Seung-Woo Lee
Eugene Investment & Securities
Kyomin Sohn
Samsung Electronics
Kangwook Lee
SK hynix
오후 3:50 - 오후 5:00
[Session 3: Material & Equipment Development] Success factors for Contract Engineering; a Dutch perspective
Sven Pekelder
Settels Savenije
오후 3:50 - 오후 4:00
오후 3:55
오후 4:00
Advanced Logic Patterning Process for High-NA Lithography
Heeyoung Koh
Samsung Electronics
오후 4:00 - 오후 4:25
Challenges and Innovations in Advanced Interconnect Metallization
Juhyun Kim
Samsung Electronics
오후 4:00 - 오후 4:25
[Session 3: Material & Equipment Development] Horizontal Integration Partner for Semiconductor Equipment Development
Dongha Kim
Prodrive Technologies
오후 4:00 - 오후 4:10
오후 4:05
오후 4:10
Addressing Semiconductor Cybersecurity Challenges through Robust Industry Standards and Globally Secure Frameworks
Alan Weber
PDF Solutions
오후 4:10 - 오후 4:35
Evolving Test Distribution in the Age of AI
Fabio Pizza
Advantest Europe
오후 4:10 - 오후 4:40
[Session 3: Material & Equipment Development] Predicting Device-Relevant Properties in ALD and ALE via Multiscale Surface-to-Device Simulation
Fedor Goumans
Software for Chemistry & Materials
오후 4:10 - 오후 4:20
오후 4:15
오후 4:20
오후 4:25
Engineering Capacitance Reduction in Advanced Logic and Memory Technology
Erik A Edelberg
Lam Research
오후 4:25 - 오후 4:50
[Session 4: New Device] Status for DBH SiC/GaN Technology development
Sang Gi Lee
DB Hitek
오후 4:25 - 오후 4:35
오후 4:30
VNAND HARC Etching’s Yesterday, Today, and Tomorrow
Hoki Lee
Samsung Electronics
오후 4:30 - 오후 4:55
오후 4:35
Advanced Interconnects Enabling 2.5D and 3D Packaging
Ravi Pokhrel
Qnity Electronics
오후 4:35 - 오후 5:00
Next Generation DRAM with Oxide Semiconductor (IGZO) and Cell Structure
Min Hee Cho
Samsung Electronics
오후 4:35 - 오후 5:00
Three Foundational Security Strategies for a Sustainable Semiconductor Industry: Training, Encryption, and Backup
Bongho Kang
Fasoo
오후 4:35 - 오후 5:00
[Session 4: New Device] Photonics Integrated Circuit
Dongjae Shin
imec Netherlands
오후 4:35 - 오후 4:45
오후 4:40
오후 4:50
Advanced Logic Technology as a Backbone of the New Era of Computing
Kisik Choi (Invited)
IBM
오후 4:50 - 오후 5:30
Leveraging Hardware Enabled AI Image Analysis for Rapid 3D X-ray Inspection
Joscha Malin
Comet AG
오후 4:50 - 오후 5:20
Navigating Overlay Metrology Challenges: High-NA Lithography, Backside Bonding, Advanced Packaging, and the Road to Massive Sampling
Nadav Gutman
KLA Corporate
오후 4:50 - 오후 5:15
오후 4:55
Non-Sinusoidal-Waveform for High Aspect Ratio Etching
Dong-Hun Kim
SEMES
오후 4:55 - 오후 5:20
오후 5:00
Advancing Materials and Integration Technologies for Next-Generation Ferroelectric Devices
Ganesh Panaman
Intermolecular
오후 5:00 - 오후 5:25
Plasma-free Hydrophilic Bonding for Wafer to Wafer and Die to Wafer 3D and Photonic Applications
Frank Fournel
CEA LETI
오후 5:00 - 오후 5:25
Proven Best Path to Secure Resilient Semiconductor Manufacturing in the Era of AI
Toru Takahashi
TXOne Networks
오후 5:00 - 오후 5:25
오후 5:05
Industrial Autonomy in the Era of Physical AI: Building the Autonomous Fab Stack
Jonghwan Lee (invited)
NVIDIA
오후 5:05 - 오후 5:30
오후 5:20
3D Nanopatterning Using Ion Beam Etching
Denis Joschko
scia Systems GmbH
오후 5:20 - 오후 5:45
2026-02-11
오전 9:00
오후 12:00
오후 1:00
S1. Advanced Lithography
2026-02-11 | 오후 1:00 - 오후 5:15
#307
S2. Advanced Materials & Process Technology
2026-02-11 | 오후 1:00 - 오후 5:30
#308
오후 2:00
2026-02-12
오전 9:00
오전 10:00
S5. CMP & Cleaning Technology
2026-02-12 | 오전 10:00 - 오후 1:45
#308
오후 1:00
S4. Plasma Science & Etching Technology
2026-02-12 | 오후 1:00 - 오후 5:45
#307
S6. Advanced Packaging
2026-02-12 | 오후 1:00 - 오후 5:50
#317
오후 2:00
Global Semiconductor Regulatory Outlook Forum
2026-02-12 | 오후 2:00 - 오후 4:00
#328