VFO Packaging for High Performance On-Device AI systems

Driven by the increasing demand for faster, more compact, and energy-efficient electronic systems, packaging technologies are rapidly advancing to enable higher levels of integration and superior performance. Among these innovations, Vertical Fan-Out (VFO) packaging has emerged as a highly promising solution, offering greater design flexibility, a reduced form factor, and enhanced electrical performance compared to conventional packaging technology. An innovative VFO packaging technology has unique features of vertical wires on reconstructing stacked dies and multiple redistributions. This presentation introduces VFO technology and its potential for memory and storage applications, where high density and efficient signal routing are critical. By enabling direct interconnection between stacked dies and integrating redistribution layers within the package, VFO supports the development of next-generation compact and high-performance memory modules. We will discuss the key features, advantages, and representative application scenarios of VFO, highlighting its role in advancing the design and performance of modern memory and storage systems.