Advanced Interconnects Enabling 2.5D and 3D Packaging

오후 4:35 - 오후 5:00

The advancement of 2.5D and 3D packaging technologies is driving the need for high-performance interconnect solutions that support increased integration density and improved thermal and electrical performance. This presentation outlines key innovations in interconnect development that enable next-generation heterogeneous integration.

We highlight a microbump extension strategy incorporating novel barrier materials designed to enhance reliability and mitigate diffusion-related failures at finer pitches. Multirole Cu is introduced to enable new interconnect designs, while novel SnAg solder is engineered to address multi-critical dimension (multi-CD) bumping challenges and achieve exceptional coplanarity across varying bump geometries. Additionally, we present low-temperature hybrid bonding techniques for chip-to-wafer (C2W) and wafer-to-wafer (W2W) applications, enabled by Cu microstructure tuning to support bonding at lower thermal budgets while maintaining surface planarity and bond integrity.

These technologies collectively form a scalable interconnect platform that meets the demands of high-performance computing, AI, and advanced memory packaging.

Featured Speakers

Ravi Pokhrel

Global R&D Leader, Qnity Electronics

Ravi Pokhrel is the Global R&D Leader for Wafer Metallization and Material Innovation in the Advanced Circuits and Packaging division of Qnity. With over 10 years of experience developing materials for advanced packaging, Ravi has led innovations across metallization technologies for Dual Damascene, IC chip packaging, IC substrates, and advanced PCB applications. His current focus is on enabling next-generation 2.5D and 3D packaging through advanced interconnect solutions, including microbump scaling with novel barrier materials, multirole Cu, advanced SnAg solder, and hybrid bonding process development.

Ravi has a strong track record in new product development and commercialization, OEM and customer engagement for co-development of emerging technologies, and strategic external partnerships to accelerate material innovation. He holds a Ph.D. in Chemistry from Yale University and completed postdoctoral research at the University of Wisconsin–Madison before beginning his industry career.