Advanced Packaging Market & Technology Trends - Focus on Glass

In the second half of the 2020s decade, Advanced Packaging progressed to take the responsibility of AI hardware' biggest challenges to enable it to deliver more computing power at a mastered cost by enlarging the package size, pushing the interconnect frontiers and the design philosophy. Glass will be a key pillar for advanced packaging in the second half of the current decade by targeting several entry points to the advanced packaging landscape at the IC substrate, Interposer, carrier and more emerging glass-based technology for Advanced Packaging. In addition to Glass, penalization, hybrid bonding, 3D stacking are the other pillars allowing Advanced Packaging to support the AI explosion and its evolution to next generations. The supply chain has changed accordingly with more geographical impact on investments, collaborations, and business models.