주요 콘텐츠로 건너뛰기

T6. Packaging Tutorial

2026-02-12 | 오전 9:00 - 오후 12:00
#317

This tutorial is designed as basic course for new engineers who are working at packaging technology related area. With the practical lecture from device maker and academia, we expect you will learn the challenges in packaging process and fundamental technologies as well. 

 

  • Date: Feb 12(Thu), 2026
  • Time: 9:00-12:00
  • Room: 317, Conference Room (South), 3F, COEX
  • Language: Korean (Simultaneous interpretation will NOT be provided.)
  • Registration Fee (KRW)
    • Early Bird: SEMI Members 132,000 / Non-members 176,000 / Student 66,000
    • Onsite: 220,000

Agenda

Advanced Semiconductor Packaging Technology : Overview

Prof. Hak-Sung Kim

Hanyang University
오전 9:00 - 오전 10:15

Q&A / Break

오전 10:15 - 오전 10:30

Advanced Semiconductor Packaging Technology : Recent Trends

JaeDong Kim

JD Technology
오전 10:30 - 오전 11:45

Q&A

오전 11:45 - 오후 12:00

* The agenda is subject to change.