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T6. Packaging Tutorial

Thursday, February 12 | 9:00 am - 12:00 pm
#317

This tutorial is designed as basic course for new engineers who are working at packaging technology related area. With the practical lecture from device maker and academia, we expect you will learn the challenges in packaging process and fundamental technologies as well.

 

  • Date: Feb 12(Thu), 2026
  • Time: 9:00-12:00
  • Room: 317, Conference Room (South), 3F, COEX
  • Language: Korean
  • Simultaneous interpretation will NOT be provided.
  • Registration Fee
    • Early Bird: SEMI Members 132,000 KRW / Non-members 176,000 KRW / Student 66,000 KRW
    • Onsite: 220,000 KRW

Agenda

Advanced Semiconductor Packaging Technology : Overview

Prof. Hak-Sung Kim

Hanyang University
9:00 am - 10:15 am

Q&A / Break

10:15 am - 10:30 am

Advanced Semiconductor Packaging Technology : Recent Trends

JaeDong Kim

JD Technology
10:30 am - 11:45 am

Q&A

11:45 am - 12:00 pm

* The agenda is subject to change.