Atomic Layer Deposition Processes for Future Extremely Scaled Semiconductor Devices
The U.S. Department of Energy (DOE) National Laboratories are advancing microelectronics through coordinated programs and world-leading user facilities that bridge fundamental science and technological innovation. In this talk, I will first provide an overview of DOE’s microelectronics research initiatives and then focus on major activities at Brookhaven National Laboratory (BNL), where we are developing next-generation extreme ultraviolet (EUV) photoresists and studying atomic layer deposition (ALD) processes for interconnect and dielectric materials in future, extremely scaled semiconductor devices. These research programs leverage BNL’s unique suite of DOE user facilities, including the Center for Functional Nanomaterials (CFN)—one of five DOE Nanoscale Science Research Centers (NSRCs)—which has deep expertise in ALD-based hybrid material synthesis and its application to EUV lithography, and the National Synchrotron Light Source II (NSLS-II), which provides frontier capabilities for structural and chemical characterization. I will highlight our recent progress in vapor-phase synthesis of novel organic–inorganic hybrid EUV resists and their patterning performance, as well as studies revealing key ALD growth characteristics of ruthenium for advanced interconnects, and ALD dielectric material deposition on two-dimensional materials envisioned for future channel applications.