MI (Metrology & Inspection) Forum

Thursday, February 12 | 10:00 am - 5:20 pm
#402

 

  • Date: Feb 12(Thu), 2026
  • Time: 10:00-17:20
  • Room: 402, Conference Room (South), 4F, COEX
  • Language: English and Korean (Simultaneous interpretation will NOT be provided.)
  • Registration Fee (KRW)
    • Early Bird: SEMI Members 242,000 / Non-members 308,000 / Student 165,000
    • Onsite: 363,000

 

Committee

  • Christopher H. Kang (Thermo Fisher Scientific)
  • MinKeun Kwak (Auros Technology)
  • Sungsu Kim (KLA)
  • TK Kim (HICS Company)
  • Yong Jun Park (Samsung Display)
  • Minsuk Seo (Camtek)
  • Yudong Soe (Onto Innovation)
  • Chaeho Shin (KRISS)
  • Kyu-Chan Shim (SK hynix)
  • Youn Tae Ahn (LUKEN Technologies)
  • Jeongho Ahn (Samsung Electronics)
  • Kyung-Bae Hwang (ASML)
  • Hyungwon Yoo (Hitachi High-Technologies)
  • DaeHa Lee (AMETEK Korea)
  • Dongchun Lee (Park Systems)
  • Myungjun Lee (Samsung Electronics)
  • Byoung-Ho Lee (Hitachi High-Technologies)
  • Yong-Woon Lim (Nextin)
  • Mansoo Jang (Applied Materials)
  • Sanghyun Han (NOVA) 

Agenda

Emergence and Evolution of Advanced Package Materials

Jihye Shim

Samsung Electronics
10:00 am - 10:30 am
View More

Overview of Emerging Memory Technologies for Next-Generation Computing

Soo Gil Kim

SK hynix
10:30 am - 11:00 am
View More

Big Chips, Tiny Chips, and Scaling 3-D System Architectures: A Hybrid Bonding Perspective

Seung Kang

Adeia
11:00 am - 11:30 am
View More

Process Control in Advanced Packaging

Yoonjoo Kim

KLA
11:30 am - 12:00 pm
View More

Poster Session & MI Forum Reception

12:00 pm - 2:00 pm
View More

Applications of High Speed IR and Micro-Bump Metrology for Advanced Packaging of Advanced Memory and Logic Devices

Yu Figer

Onto Innovation
2:00 pm - 2:30 pm
View More

Nano Topography Technologies for the Mass Production of Hybrid Bonding Process

Joonho You

Nexensor
2:30 pm - 3:00 pm
View More

From Dimensions to Properties: Novel Approaching of E-Beam Technology

Keiichiro Hitomi

Hitachi High-Tech
3:00 pm - 3:30 pm
View More

Break

3:30 pm - 3:50 pm
View More

Advanced Optical Metrology Solutions for AI Packaging Processes

Fabian Schneider

Nova
3:50 pm - 4:20 pm
View More

In-Line 3D SEM Metrology Data for 3D Technology Inflections in Memory, Adv. Packaging and Logic Fabs

Nimrod Shuall

Thermo Fisher Scientific
4:20 pm - 4:50 pm
View More

Leveraging Hardware Enabled AI Image Analysis for Rapid 3D X-ray Inspection

Joscha Malin

Comet AG
4:50 pm - 5:20 pm
View More

*The agenda is subject to change. 

Sponsors