Process Control in Advanced Packaging
As silicon scaling reaches its limits, the industry is shifting from a monolithic chip approach to a multichip architecture integrated through advanced packaging, called “disaggregation & heterogeneous integration”. As the advanced packages continue to evolve, their structures become more complex and their feature sizes become smaller, which makes process control more challenging and increases the need for more frequent inspection.
However, MI tools used in traditional packaging lines are no longer sufficient to meet these requirements, and there is a growing demand for the type of MI systems that have been used in wafer fabs.
KLA provides metrology and inspection solutions that deliver precise, fast, and reliable measurements and defect detection. These solutions help improve yield and productivity and support stable manufacturing for advanced packaging technologies.
