Poster Session & MI Forum Reception
- Date: Feb 12(Thu), 2026
- Time: 12:00-14:00
- Room: 402 Lobby, Conference Room (South), 4F, COEX
- Language: English and Korean
- Simultaneous interpretation will NOT be provided.
Posters
Early Detection of Process Window Shifts in ALD processes by Ultra-High Aspect Ratio Test Structures Mikko Utriainen | Chipmetrics
|
High Sensitivity and Low Cost of Ownership Glass Carrier Inspection and UV Transmittance for Applications in Thinned Wafer Processing Jason Lin | Onto Innovation
|
Automated Workflow Integration for Semiconductor Failure Analysis Using CAD Navigation and AI-Based Image Analysis Changeun Lee | Synopsys
|
Quantitative Hydrogen Analysis by Time of Flight-Elastic Recoil Detection Analysis (TOF-ERDA) using Medium Energy Ion Won Ja Min | HB Solution
|
Atomic Force Microscopy Characterization for Hybrid Bonding Interface Optimization Daeho Kim | Bruker
|
AI & HBM Contact Solution, M-POGO Eunsang Lee | LUKEN Technolgies
|
High-Resolution UV-Based Defect Inspection System for Advanced Packaging and Hybrid Bonding Yong-Woon Lim | Nextin
|
AFM Characterization of Sidewall and Critical Dimensions in Photonic and Power Devices Seung Yeon Sung | Park Systems |
Committee
- Christopher H. Kang (Thermo Fisher Scientific)
- MinKeun Kwak (Auros Technology)
- Sungsu Kim (KLA)
- TK Kim (HICS Company)
- Yong Jun Park (Samsung Display)
- Minsuk Seo (Camtek)
- Yudong Soe (Onto Innovation)
- Chaeho Shin (KRISS)
- Kyu-Chan Shim (SK hynix)
- Youn Tae Ahn (LUKEN Technologies)
- Jeongho Ahn (Samsung Electronics)
- Kyung-Bae Hwang (ASML)
- Hyungwon Yoo (Hitachi High-Technologies)
- DaeHa Lee (AMETEK Korea)
- Dongchun Lee (Park Systems)
- Myungjun Lee (Samsung Electronics)
- Byoung-Ho Lee (Hitachi High-Technologies)
- Yong-Woon Lim (Nextin)
- Mansoo Jang (Applied Materials)
- Sanghyun Han (NOVA)
Sponsors
