S2. Advanced Materials & Process Technology

Architecting the Angstrom Era: A New Paradigm in Materials and Processes

This session will highlight cutting-edge research and development in advanced materials and process technologies as the foundational architects of the Angstrom era. Prominent presenters from global research institutes and industries will share their insights on three focused themes: memory, equipment and materials, and BEOL. The eight exceptional presentations, including visionary invited talks from imec and IBM, will address major technical challenges and deliver transformative solutions for the next generation of computing by exploring AI-driven materials advances, atomic-level process control, and innovative interconnect technology to overcome physical scaling limits. 

• Date: Feb 11(Wed), 2026
• Time: 13:00-17:30
• Room: 308, Conference Room (South), 3F, COEX
• Language: English (Simultaneous interpretation will NOT be provided.)
• Registration Fee (KRW)
  • Early Bird: SEMI Members 198,000 / Non-members 275,000 / Student 132,000
  • Onsite: 330,000

Committee

• Andy Kim (Lam Research Korea)
• Hyungsub Kim (Sungkyunkwan University)
• Hyoung-Yoon Kim (DB HiTek )
• Seungwook Ryu (SK hynix)
• Ki-Seon Park (SK Materials)
• Jeonghoon Park (Tokyo Electron Korea)
• Jin-Seong Park (Hanyang University)
• Hyun-Chul Sohn (Yonsei University)
• Won-Jun Lee (Sejong University)
• Chang-won Lee (Merck)
• Ho-Chang Lee (Applied Materials Korea)
• In-Gon Lim (A-PRO)
• Hanjin Lim (Samsung Electronics)