Technical Challenges for 3D-NAND Extension

As 3D NAND continues to scale vertically, the technical challenges associated with increasing layer counts are becoming increasingly evident. Although stacking more layers remains the primary strategy for boosting cell density, the cost and effort required to achieve further improvements are rising sharply — signaling that the current approach is nearing its practical limits and may no longer be sustainable. 

It is now essential to identify the scope within which the current method still performs effectively — and to thoughtfully evaluate when and how new technologies should be introduced beyond that scope. Such adjustments might involve new materials, refined architectures, or process optimizations — not as full replacements, but as targeted enhancements to support the continued evolution of current technologies. 

This presentation reviews the current state of 3D NAND scaling and focuses on the key technical challenges that must be addressed when considering future directions.