[Presentations (Moderator: Prof. Yoon-Jong Lee, KAIST)] The Role of Semiconductor Packaging in the AI Era: Innovations in Advanced Packaging Technologies Accelerating the AI Era

3:15 pm - 3:40 pm

Generative AI must process and infer from massive volumes of data in real time. Even with highly capable GPUs, performance bottlenecks arise if the data pathway (bandwidth) is constrained. Therefore, scaling AI models and computation requires breakthroughs in data throughput. AI accelerators enabled by 2.5D SiP (System-in-Package) and HBM (High Bandwidth Memory) have been key to this shift. With advantages in power efficiency and thermal management, AI accelerators are now regarded as essential semiconductors for AI data centers.

As core building blocks for high-performance AI systems, 2.5D SiP and HBM—critical for large-scale data computation—are the result of integrated innovations in packaging architecture, processes, and materials. Going forward, continued advances in advanced semiconductor packaging are expected to accelerate the AI era and drive growth across the AI industry.

This talk will review the development of advanced packaging technologies such as HBM and 2.5D SiP that have enabled the AI era, and discuss future directions needed to sustain and lead AI industry growth.

Featured Speakers

Kangwook Lee

VP, SK hynix

Dr. Lee is a globally recognized expert and pioneer in advanced semiconductor packaging and 3D TSV-stacked memory, including HBM (High Bandwidth Memory). With over 27 years of experience, he has led 3D integration/packaging R&D spanning core technology and product development, reliability, and high-volume manufacturing for HBM.

He received his Ph.D. in Machine Intelligence and Systems Engineering from Tohoku University (2000), and completed postdoctoral research at Rensselaer Polytechnic Institute (2001–2002). He worked at Samsung Electronics as a Principal Engineer (2002–2008), served as a Professor at Tohoku University’s NICHe (2008–2016), and was a VP at Amkor Technology Korea R&D Center (2017–2018). He joined SK hynix in 2018 and currently serves as Senior Vice President and Head of Package Development.

Dr. Lee’s contributions have been recognized with major honors, including the IEEE EPS Electronics Manufacturing Technology Award (2024), the Daewon Kahng Award (2025), and the ISES Hall of Fame (2025). He is a Senior Member of IEEE.