Kangwook Lee

Dr. Lee is a globally recognized expert and pioneer in advanced semiconductor packaging and 3D TSV-stacked memory, including HBM (High Bandwidth Memory). With over 27 years of experience, he has led 3D integration/packaging R&D spanning core technology and product development, reliability, and high-volume manufacturing for HBM.

He received his Ph.D. in Machine Intelligence and Systems Engineering from Tohoku University (2000), and completed postdoctoral research at Rensselaer Polytechnic Institute (2001–2002). He worked at Samsung Electronics as a Principal Engineer (2002–2008), served as a Professor at Tohoku University’s NICHe (2008–2016), and was a VP at Amkor Technology Korea R&D Center (2017–2018). He joined SK hynix in 2018 and currently serves as Senior Vice President and Head of Package Development.

Dr. Lee’s contributions have been recognized with major honors, including the IEEE EPS Electronics Manufacturing Technology Award (2024), the Daewon Kahng Award (2025), and the ISES Hall of Fame (2025). He is a Senior Member of IEEE.