S6. Advanced Packaging

Advanced Packaging in a New AI Era 

This session will highlight the expanding role of advanced packaging technologies as a critical foundation for AI-driven computing, high-performance systems, and heterogeneous integration. As AI applications place growing demands on performance density, power efficiency, and system complexity, advanced packaging has emerged at the forefront of semiconductor innovation. The session will examine how approaches such as 2.5D and 3D integration, fan-out and glass-based substrates, and heterogeneous packaging architectures are being adopted to address these challenges, alongside key market and technology trends. 

Experts from leading semiconductor companies, equipment suppliers, and research institutions will offer a comprehensive perspective on how advanced packaging is reshaping system design in the AI era—enabling performance scaling beyond conventional limits and supporting the industry’s transition toward future architectures and highly integrated systems.

• Date: Feb 12(Thu), 2026
• Time: 13:00-17:50
• Room: 317, Conference Room (South), 3F, COEX
• Language: English (Simultaneous interpretation will NOT be provided.)
• Registration Fee (KRW)
  • Early Bird: SEMI Members 198,000 / Non-members 275,000 / Student 132,000
  • Onsite: 330,000

Committee

• Un-Byoung Kang (Samsung Electronics)
• Gu-Sung Kim (Kangnam University)
• Hak Sung Kim (Hanyang University)
• Young Bae Park (Gyeongkuk National University)
• Soonheung Bae (ASE Korea)
• Incheol Baek (DB HiTek)
• Min Suk Suh (Camtek Korea)
• Hoyoung Son (SK hynix)
• Hwadong Oh (LB Semicon)
• Daehee Weon (Applied Materials Korea)
• Dongsu Ryu (Amkor Technnology Korea)
• Chris Lee (Hanmi Semiconductor)
• Kwangjoo Lee (LG Chem)
• Seh Kwang Lee (Ehwa Diamond)
• SeungWoo Choi (Tokyo Electron Korea)