From Silicon to Systems: Advanced Packaging enabling AI Performance Scaling

AI computing is driving a fundamental redefinition of semiconductor architecture, where system performance and power efficiency are increasingly determined by how logic and memory are integrated rather than by transistor scaling alone. Advanced packaging has become the new enabling semiconductor architecture for AI, enabling close integration of logic and high-bandwidth memory (HBM) through 2.5D and 3D architectures that deliver extreme bandwidth density. 

This architectural shift introduces significant manufacturing challenges across the advanced packaging flow. As HBM stacks scale in capacity and I/O count, packaging faces critical challenges including finer interconnect pitch, warpage control, thermal dissipation, and yield sensitivity. Meanwhile, to address cost and throughput constraints, the industry is accelerating the transition toward panel-level manufacturing, introducing new requirements for process uniformity, defect control, and equipment scalability across larger form factors. 

In this presentation, Lam Research will discuss how the industry is addressing the opportunities and challenges of advanced packaging and how it’s process and equipment innovations are enabling this architectural shift. By delivering solutions across key packaging process modules, supporting both wafer- and panel-based platforms, Lam is helping customers overcome scaling and manufacturability challenges as advanced packaging evolves into a core architectural and manufacturing foundation for AI systems.