Architecting the AI Era: Advanced Packaging as a Strategic Enabler

2:40 pm - 3:10 pm

The rapid acceleration of artificial intelligence is transforming every aspect of semiconductor design and manufacturing. As traditional transistor scaling approaches physical and economic limits, advanced packaging has emerged as a pivotal driver of system-level innovation, enabling higher bandwidth, greater energy efficiency, and new pathways for heterogenous integration. 

High-bandwidth memory (HBM) and advanced interconnect architectures are at the center of this transformation, redefining how compute and memory come together to meet the demands of AI workloads. The convergence of technologies such as fine-pitch bumping, die-to-wafer & wafer-to-wafer bonding and panel-level packaging is expanding boundaries of performance and scalability. 

Realizing this potential requires deep collaboration across the semiconductor ecosystem, spanning design, materials, equipment, and manufacturing to accelerate the path from lab innovation to high-volume production. Applied Materials is addressing the challenges of Advanced Packaging by leveraging its broad portfolio of semiconductor and display fabrication technologies drawing on proven capabilities from Front End and Display manufacturing to deliver innovative packaging solutions. This session explores how advanced packaging is shaping the next era of semiconductor progress, enabling industry to deliver the performance and efficiency required to power the AI revolution. 

Featured Speakers

Mike Chudzik

Mike Chudzik (invited)

VP of Technology, IMS ICAPS & Packaging, Semiconductor Products Group, Applied Materials

Dr. Chudzik is a Vice President & Master of Technology at Applied Materials. He leads the Integrated Materials Solutions (IMS) team developing new emerging module technologies for Heterogenous Integration and Specialty electronics. This includes managing teams of device integrators, process and device engineers to deliver on large scale module and device fabrication projects. In advance packaging, the IMS team has delivered innovative new processes and modules across hybrid copper bonding, fusion bonding, thermal materials, fine-pitch RDL, MCMs and solder reflow for advanced logic, memory and specialty devices. 

Prior to Applied Materials, Mike was at IBM for 14 years where he led teams in the R&D of advanced semiconductor process integration. He received his Ph.D. in electrical engineering at Northwestern University.