Mike Chudzik (invited)

Dr. Chudzik is a Vice President & Master of Technology at Applied Materials. He leads the Integrated Materials Solutions (IMS) team developing new emerging module technologies for Heterogenous Integration and Specialty electronics. This includes managing teams of device integrators, process and device engineers to deliver on large scale module and device fabrication projects. In advance packaging, the IMS team has delivered innovative new processes and modules across hybrid copper bonding, fusion bonding, thermal materials, fine-pitch RDL, MCMs and solder reflow for advanced logic, memory and specialty devices. 

Prior to Applied Materials, Mike was at IBM for 14 years where he led teams in the R&D of advanced semiconductor process integration. He received his Ph.D. in electrical engineering at Northwestern University.