[Presentations (Moderator: Prof. Yoon-Jong Lee, KAIST)] From Chip War to AI War

2:25 pm - 2:50 pm

This presentation examines the structural transformation of the semiconductor industry driven by AI, with a focus on advanced packaging technologies. As AI models scale and accelerated datacenter workloads expand, traditional monolithic die approaches have reached their physical limits, pushing the industry into a post-reticle era defined by 2.5D/3D packaging, chipletarchitectures, HBM, and hybrid bonding.

The presentation compares major advanced packaging technologies market in 2024, growth outlook through 2030, and the competitive strategies of key players. Particular emphasis is placed on the rapid expansion of HBM-centric 3D packaging and the growing importance of active silicon interposers.

In addition, the presentation explores the implications of potential post-transformer AI models, where evolving compute architectures, memory access patterns, and increased on-chip SRAM utilization may reshape packaging and memory requirements. In this context, advanced packaging is positioned not merely as an integration solution, but as a foundational technology defining the next generation of AI semiconductor architectures.

Featured Speakers

Seung-Woo Lee

Head of Research / VP, Research Division, Eugene Investment & Securities

Seungwoo Lee has been the head of research at Eugene Investment & Securities for 6 years with responsibility for research division and semiconductor segment.

Prior to joining Eugene, Lee built his career at Daewoo Economic Research Institute, Shinyoung Securities, Rhee Capital Advisors and IBK Investment & Securities. As a semiconductor analyst, he has been recognized as a best analyst multiple times by leading media outlets like Hankyung Business, Maeil Business newspaper, Yonhap Infomax. Chosun Il-bo and so on.

Lee received a master’s degree in Business Administration and a bachelor’s degree in Computer Engineering from Seoul National University.