Rethinking systems to scale AI
From datacenters to robots and cars: AI is transforming the full spectrum of applications from cloud to edge. The question of how to fulfill its continually increasing performance demands is shared by all who strive for an intelligent infrastructure to enhance our lives.
Realizing these demands requires more than improvements to individual devices or components: scaling AI has become a system challenge. Further gains in AI compute performance and energy efficiency depend on coordinated innovation across logic, memory, interconnects, system architecture, packaging, power delivery, and thermal management.
At ITF Korea, we tackle the question of how we can rethink compute systems to support continued AI scaling. Industry leaders and imec experts will examine beyond-2nm logic-device concepts, evolving memory hierarchies and interfaces, advanced packaging and 3D system integration, silicon-photonics-based interconnects, and the associated power and thermal challenges.
You'll discover how the concerted combination of these advances will bring about the performance improvements we need to allow AI to realize its promise.
The second part of the program will explore application-level requirements, from AI-enabled mobility to physical AI systems that sense, understand and interact with the world around them.
The event will conclude with a networking reception, where technology and business leaders from across the semiconductor ecosystem will exchange perspectives on the future of AI and explore new opportunities for collaboration.
Join us at ITF Korea to explore how system-level innovation can sustain AI scaling from the datacenter to the intelligent edge.
※ Further details will be announced in December 2026.