John H Lau

John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 515 peer-reviewed papers (out of which 370 are the principal investigator), 40 issued and pending US patents (out of which 25 are the principal inventor), and 23 textbooks (all are the first author), e.g., Chiplet Design and Heterogeneous Integration Packaging (Springer, 2023). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.