TaeKyeong Hwang

TaeKyeong Hwang, Ph.D. joined Amkor in 2005 and is currently an Advanced Assembly Technology Project Leader, with responsibility low density fan-out and high densify fan-out package development. Prior to this position, he was the SiP Product Development Project Leader and lead advanced SiP platform developments such as double side molded BGA (DSmBGA), 5G AiP module and heterogeneous module SiP development. Hwang holds a Ph.D. degree in Mechanical Engineering from KAIST, Daejeon, Korea.