Advanced Packaging and the Future of System Optimization

10:40 am - 11:00 am

Global AI infusion is redefining performance, power, and integration requirements, placing advanced packaging at the forefront of semiconductor innovation. As chip architecture complexity increases, the industry is progressing beyond device-level scaling toward system-level optimization. Advances in heterogeneous integration and packaging-enabled co-design are shaping more efficient, scalable, and resilient systems. Moving forward, system-centric strategies that align architecture, packaging, and collaboration across the ecosystem are paramount to shaping the golden era of AI and semiconductors.

Featured Speakers

Tien Wu

CEO, ASE

Dr. Tien Wu is the Chief Executive Officer of Advanced Semiconductor Engineering, Inc. (ASE) and concurrently the Chief Executive Officer of Universal Scientific Industrial Co., Ltd. (USI). He is also a member of the Board of Directors and Chief Operating Officer of the ASE Technology Holding Co., Ltd. (NYSE: ASX, TWSE: 3711).

Tien serves as the Chairman of SEMI Board and Board Member of the Global Semiconductor Association (GSA), which are global industry associations serving the manufacturing supply chain for the micro- and nano-electronics industries.

Prior to joining ASE, Tien held several management positions within IBM including R&D, manufacturing and sales in the United States, Europe and Asia-Pacific. He holds twelve U.S. patents and has authored over twenty-five articles.

Tien holds a BSCE degree from National Taiwan University and earned MS and Ph.D. degrees in mechanical engineering and applied mechanics respectively from the University of Pennsylvania. In 2015, Tien received an Honorary Degree of Doctor of Science from Binghamton University. In 2024, Tien was elected to the United States National Academy of Engineering, for sustainable electronics manufacturing and advancements in the high-volume production of semiconductor packaging.