Next-Gen CMP Metrology: Integrated Metrology Innovations for Bonding and Edge Control

The semiconductor industry’s shift toward heterogeneous integration, AI acceleration, and advanced packaging is reshaping CMP (Chemical Mechanical Planarization) requirements. As device architectures become more complex, CMP must deliver tighter control over topography, edge uniformity, and bonding interfaces. Integrated metrology (IM) is emerging as a critical enabler, offering in-line, high-throughput insights that support yield and performance in high-volume manufacturing. This is especially vital in applications like hybrid bonding, where sub-nanometer control is essential for interconnect integrity. 

In this talk, we will present innovative CMP-focused Integrated Metrology solutions. We will discuss innovations in wafer edge metrology that deliver fast, accurate measurements for edge-dominated CMP processes such as Trim and EBR monitoring, Edge thickness, and Edge defects affecting bonding quality. Additionally, we will present integrated metrology solutions for bonding processes using a combination of OCD and Imaging within IM to enhance advanced process control and AI-enhanced solutions that improve yield through in-die monitoring. These advancements empower fabs to detect variations early, optimize CMP steps, and accelerate ramp-up in advanced logic and memory nodes.