Surface Preparation Challenges in 3D Integration

11:15 am - 11:55 am

The advancement of 3D integration technologies, especially bonded dies to wafer and hybrid bonding, imposes stringent requirements on surface preparation processes. Effective removal of contaminants, including particles and residues, is critical to ensure high-yield bonding and device reliability. This presentation addresses key challenges in surface preparation, focusing on wet cleaning techniques and emerging methods under development to enhance contaminant removal efficiency. Special attention is given to wafer edge management and the critical issue of wafer charging associated with the use of resistive substrates. Through a comprehensive overview of current practices and innovative solutions, this talk provides valuable insights into overcoming surface preparation challenges in advanced 3D integration. 

Featured Speakers

S5_Philippe Garnier

Philippe Garnier (invited)

Senior Member of Technical Staff – Wet 3Di R&D, STMicroelectronics

With 25 years of experience in wet process technology for semiconductor manufacturing, Philippe is an R&D senior expert in materials and surface preparation at STMicroelectronics.  

Starting in 2001 as process engineer for Philips semiconductors, within the Crolles Alliance, he has developed pioneering wet single wafer tools and gate oxide patterning techniques. In 2008, he was developing 32/28nm nodes for ST Microelectronics, within the IBM Alliance, East Fishkill, NY, USA. Along his carreer at STMicroelectronics, he has been deeply involved in the development of many technologies (eDRAM, eNVM, Logic, FDSOI, Photonics, image sensors, BiCMOS and Qubits). His innovations have improved manufacturing efficiency, reduced costs, and enhanced product quality. In addition, Philippe supervises PhD studies on topics such as wetting, acoustics, wet chemistry infiltration, and particle removal.  

Senior Member of the ST Technical Staff, Philippe has an MS in Chemistry from ENSIACET, Toulouse, France. He has published over 60 papers at international conferences.