Ravi Pokhrel

Ravi Pokhrel is the Global R&D Leader for Wafer Metallization and Material Innovation in the Advanced Circuits and Packaging division of Qnity. With over 10 years of experience developing materials for advanced packaging, Ravi has led innovations across metallization technologies for Dual Damascene, IC chip packaging, IC substrates, and advanced PCB applications. His current focus is on enabling next-generation 2.5D and 3D packaging through advanced interconnect solutions, including microbump scaling with novel barrier materials, multirole Cu, advanced SnAg solder, and hybrid bonding process development. 

Ravi has a strong track record in new product development and commercialization, OEM and customer engagement for co-development of emerging technologies, and strategic external partnerships to accelerate material innovation. He holds a Ph.D. in Chemistry from Yale University and completed postdoctoral research at the University of Wisconsin–Madison before beginning his industry career.