Frank Fournel

Frank FOURNEL graduated from ESPCI (Paris) with a master in Materials Science, and got his PhD in 2001. He has been employed by CEA since 2001. He is now at the head of the wafer bonding technology engineering in LETI and board member of the international ECS Wafer Bonding Symposium conference, the International   Wafer’Bond conference and the Low Temperature Bonding 3D conference. He has more than 231 international publications with an h-index of 29, 133 deposited patents. He passed his HDR in 2009. He his French Research Director since 2021. He is CEA Fellow since 2023