Ki Jun Sung

Ki-Jun Sung is a Senior Engineer of the Advanced Package Development Department at SK hynix Inc., Icheon-si, Gyeonggi-do, Republic of Korea. He joined SK hynix Inc. in 2011 and worked as an integration Engineer for embedded memory and 2.5D packaging. His research activities include the development of the fabrication and interconnection for advanced packaging related to FOWLP technology. He received his MS from the Department of Advanced Device Technology, U. of Science and Technology, Rep. of Korea. Email [email protected]