Hyun Chul Jung

Hyun Chul Jung, Ph.D. has been a Principal Engineer at Samsung Electronics Co., Ltd. since 2019, with responsibilities covering advanced package integration and process development. His technical contributions include key roles in panel-level packaging (PLP) and chip-on-wafer hybrid bonding technologies. Currently, he is actively involved in the development of co-packaged optics (CPO) solutions, focusing on high-bandwidth, energy-efficient interconnects for AI and data center applications. 

Prior to joining Samsung Electronics, Dr. Jung was the group Leader of the Advanced Package Process Development at Samsung Electro-Mechanics Co., Ltd. During his 17 years at Samsung Electro-Mechanics, Dr. Jung focused on pioneering new technologies and products to secure future growth engines, including industrial inkjet solutions, energy storage systems for HEV/EV applications, panel level packaging technology. 

Dr. Jung received a Ph.D. degree in Chemical Engineering from Korea University, Seoul, Korea.