Jeongsoo Kim (Invited)

Jeongsoo Kim is R&D Team Leader at imec, Belgium, where he leads research on advanced dry etch process technologies for 3D-IC, advanced packaging, and 3D memory integration. His work focuses on developing innovative etch solutions to support next-generation semiconductor technologies.

Prior to joining imec in 2024, Jeongsoo held senior technical and managerial roles at Intel, Micron Technology, and Samsung Semiconductor R&D Center, contributing to process development for advanced memory devices. He began his career as an Integration Engineer at SK Hynix.

Jeongsoo earned a master’s degree in Plasma Physics from POSTECH in 2007. He has worked extensively on plasma-based etch processes and integration technologies for advanced semiconductor devices