Pierre Morrin

Pierre Morin, Ph.D. has been with imec since 2017, starting with the responsibility for the thin films for patterning and FEOL silicon technologies. He is currently in charge of the research on advanced deposited channels (semiconductor metal oxide and 2D transition metal dichalcogenides), gate stacks for silicon and 2D technologies, and the materials for thermally stable contacts. Prior to joining imec, Pierre Morin was with STMicroelectronics, being the lead process and material engineer for logic and memory technologies. He has been an assignee at the IBM alliance in Albany NY from 2012 to 2015, developing FinFET. Before joining STMicroelectronics in 2000, Pierre Morin has been with Phillips. Pierre Morin received a degree from the “Ecole Nationale Supérieure de Chimie et Physique” of Bordeaux/France (ENSCPB) in 1991 and a PhD degree from the University of Paris/France in 1995, in the field of material science and electronics.