Christian Goetze is Member of Technical Staff in the global Packaging Technology Integration group at GLOBALFOUNDRIES, based in Dresden, Germany. He is responsible for the RF-packaging development for 5G, mmWave and IoT applications incorporating advanced silicon technology nodes as 45RFSOI, 28nm and 22FDx.
Christian Goetze joined Globalfoundries in 2010 and managed multiple packaging development and qualification programs with close collaboration to global Assembly and Test houses.
Prior to joining Globalfoundries, Goetze worked as process and integration engineer at NOKIA-SIEMENS-Networks, Qimonda and Infineon. In these positions he worked on second level assembly process development and optimization for memory modules and communication boards.
Christian Goetze received a Master of Science degree in Electrical Engineering from the Dresden University of Technology, Germany. In his master work, a cooperation of TU Dresden and SIEMENS, he studied the interfaces in Pb-free second level interconnects and their influence to the board level reliability.
본 연사의 발표는 S6. Electropackage System and Interconnect Product(STS) 에서 볼 수 있습니다.