Seung-Hyun Chae, Ph.D. joined SK Hynix in 2017 and his primary focus lies on advanced package reliability.
Prior to joining SK Hynix, Seung-Hyun Chae was Member Group Technical Staff (MGTS) for Texas Instruments in U.S.A. During his 8 years at Texas Instruments, Chae spent time working on Chip-Package Interaction (CPI) based design rule development, solder electromigration (EM) reliability, package reliability improvement, and material characterization/methodology development. In 2007, he interned at IBM T.J. Watson Research Center, NY, U.S.A.
Chae received a B.S. degree from Seoul National University, Seoul, S. Korea and a M.S/Ph.D. degree from The University of Texas at Austin, U.S.A., all in Materials Science and Engineering. He authored or co-authored two book chapters and more than 20 technical articles. He is a recipient of SRC (Semiconductor Research Corporation) Mahboob Khan Outstanding Industry Liason Award in 2013.
본 연사의 발표는 S6. Electropackage System and Interconnect Product(STS) 에서 볼 수 있습니다.