02-531-7800

Korean


전희숙

Engineer
삼성전자

Heesook Cheon has been an engineer at Samsung Electronics for 4 years with responsibility of CMP (chemical mechanical polishing) process development. Ms. Cheon developed CMP process technology for 20 nm and 1X nm DRAM especially, a variety of polymer / metal / poly-silicon CMP technologies, including DRAM process integration.

Ms. Cheon received the bachelors’ degree in Chemical and Biomolecular Engineering from the Sogang University, Seoul, South Korea.

 

본 연사의 발표는 S5. Contamination-free Manufacturing and CMP Technology(STS) 에서 볼 수 있습니다.

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