Oscar Shih is currently the department manager of Corporate R&D, ASE Group and responsible for packaging miniaturization through combining wafer process, and packaging techniques.
He has over 10 years R&D experience in advanced packaging, SiP process development and 2.5D technologies; moreover, he dedicated to material and process development of 2.5D as well as wafer level package since 2015. He also led the development of SiP technology development for advanced packaging. Mr. Shih brought 2.5D last application into a wide range of HPC & networking, including World’s 1st 2.5D IC with HBM of the industry.
Oscar Shih was specialized in Material Science and received his master degree from National Tsing Hua University, Taiwan.
본 연사의 발표는 S6. Electropackage System and Interconnect Product(STS) 에서 볼 수 있습니다.