Jungsoo Byun, Ph.D. is Master of Samsung Electro-Mechanics and currently technical leader of PLP Advanced Development Team.
Jungsoo Byun received his Master degree in Metallurgical Engineering from Seoul National University in 1998, and his Ph.D. degree in Materials Science and Engineering from Seoul National University, Seoul, Korea in 2001. Since 2003, he has been a researcher of SEMCO especially for FCCSP substrate and PLP technology development.
본 연사의 발표는 S6. Electropackage System and Interconnect Product(STS) 에서 볼 수 있습니다.