S5. Contamination-free Manufacturing and CMP Technology

Room #308, COEX Thursday, February 01
1:00pm to 5:00pm

Language: English (Simultaneous interpretation will NOT be provided)


  SEMI 회원사 비회원사 학생
사전등록(2/1까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원


Co-organized by Korea CMP UGM
Korea Surface Cleaning UGM (KSCUGM)


Continuous shrinkage of device dimension to nm level requires new materials and device structure which demand a new paradigm in contamination control and planarization to improve the production yield and device reliability. CFM technology has become more important in device manufacturing below 20 nm devices. Film loss free and damage free cleaning technology face to serious challenges for next generation device cleaning. Also CMP has grown to be one of the indispensable technologies for advanced node device fabrications such as FinFET, III/V materials and V-NAND. 7-nm logic technology is already under developing now; and CMP will play the main roll on patterning for sub-7 nm technology. In order to achieve the advanced process successfully, it is essential to make the combination among consumable parts in CMP. The purpose of this session is to increase the level of understanding on current and future CFM/CMP technology. Therefore, we are trying to share our intensive and profound perspectives through some remarkable speeches here.


  • Kyunghyun Kim (Samsung Electronics)
  • Sang Yong Kim (Korea Polytechnics)
  • Ho Youn Kim (Dongbu HiTek)
  • Jin-Goo Park (Hanyang University)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Eung-Rim Hwang (SK hynix)


Session 1: CMP Technology
13:00-13:40 Study on CMP Defects Failure Mechanism from the Viewpoint of Cleaner Module Design
  Ji Chul Yang, GLOBALFOUNDRIES (invited)
13:40-14:00 Post‐CMP Defect Management in Advanced Node DRAM Development
  Hyo-Chol Koo, SK hynix
14:00-14:20 The Necessity of Topology Control CMP in Memory Fabrication
  Hyunsoo-Kim, Samsung Electronics
14:20-14:40 New Materials and Impact to CMP for Advanced Node Integration Schemes
  Mark L. O’Neill, Versum Materials
14:40-15:00 Break
Session 2: CFM Technology
15:00-15:40 Challenges in Wet Processing of High Aspect Ratio Nanostructures
  XiuMei Xu, imec (invited)
15:40-16:00 The Prospects and Challenges for Leading Edge Drying Technology
  Ji hoon Cha, Samsung Electronics
16:00-16:20 Particle Adsorption Mechanism during Batch Cleaning Process
  Sangsoo Kim, SK hynix
16:20-16:40 Continuous Monitoring of Particles at 20nm in Critical Semiconductor Process Chemicals
  Dan Rodier, Particle Measuring Systems


*상기 일정은 사전 안내 없이 변경될 수 있습니다.

* 발표 자료는 당일 컨퍼런스 종료 후 사이트를 통해 배포됩니다 (연사가 동의하지 않는 경우는 배포되지 않음).

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