S4. Plasma Science and Etching Technology

Room #307, COEX Thursday, February 01
1:00pm to 5:00pm

Language: English (Simultaneous interpretation will NOT be provided)


  SEMI 회원사 비회원사 학생
사전등록(2/1까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원


The semiconductor devices have advanced rapidly and changed our world drastically. Do you know there has been the plasma technologies behind these advancements? The plasma technologies have largely contributed to make the sophisticated, complex and various semiconductor devices.

The plasma technologies have created the various process technologies like plasma-assisted etching, deposition and even cleaning and lithography. The plasma studies lead to the high-tech equipment, precious plasma control, software, and simulation in the manufacture environment and also make 3-D structure, fine feature sizes by multi-patterning processing, fine pattern by atomic layer processing, and high performance by metallic materials processing in the application environment.

Above all things, these days we are still focusing on existing devices to maximize the high performance and high productivity. Especially, we are also concentrating on the New Memory Devices featuring high speed, high endurance and low power consumption to gain the variety of applications and functions. To quench the desires, we invited professionals from the industries and academic.

It is believed that this symposium will provide valuable discussion among professionals and experts working in the exciting areas for a long time.


  • Jaesoung Kim (Dongbu HiTek)
  • Gyoungjin Min (Lam Research Korea)
  • Jongchul Park (Samsung Electronics)
  • Jong Won Shon (ASM Genitech)
  • Geun Young Yeom (Sungkyunkwan University)
  • Minsuk Lee (SK hynix)
  • IC Jang (Lam Research Korea)


13:00-13:20 Novel Atomic Order CD Control Technology for 5nm Node and Beyond
  Toru Hisamatsu, Tokyo Electron
13:20-13:40 High Aspect Ratio Etch Technology for 3D NAND Devices
  Moosung Kim, SK hynix
13:40-14:20 Plasma Etching of Unconventional Materials: Is There Any Systematic Approach?
  Prof. Satoshi Hamaguchi, Osaka University (invited)
14:20-14:40 Optimizing Etch Processing for Multi-Patterning 
  Amulya Athayde, Applied Materials
14:40-15:00 Break
15:00-15:30 Tomographic Emission Spectroscopic Diagnostics of Low Temperature Plasmas
  Prof. Wonho Choe, KAIST (invited)
15:30-16:10 Fabrication Challenges of Future 3D Storage Class Memory
  Luca Di Piazza, imec (invited)
16:10-16:30 Investigation of Reactive Ion Etching (RIE) Induced Damage Mechanism and Development in Sub-20nm PRAM Patterning
  Hyejin Choi, Samsung Electronics
16:30-16:50 Break
16:50-17:30 Transition of Memory Technologies
  SangBum Kim, IBM Research (invited)
17:30-17:50 How to Tackle One of the Grand Etch Challenges: Uniformity to Zero Edge Exclusion
  Chris GN Lee, Lam Research
17:50-18:10 Plasma Dicing - Latest Developments
  Christopher Johnston, Plasma Therm

*상기 일정은 사전 안내 없이 변경될 수 있습니다.

* 발표 자료는 당일 컨퍼런스 종료 후 사이트를 통해 배포됩니다 (연사가 동의하지 않는 경우는 배포되지 않음).

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