Language: English (Simultaneous interpretation will NOT be provided)
|사전등록(2/1까지)||150,000 원||180,000 원||80,000 원|
|현장등록||180,000 원||200,000 원||100,000 원|
Advanced Lithography session of the STS 2017 will offer the opportunities to review the recent trends in the main stream lithography technologies under the theme of "Readiness of EUV or Alternative".
As EUV is expected to enter the manufacturing phase in near future, it will be a perfect opportunity to check the overall readiness and progress of EUV technology in practical aspects. Prominent leading researchers in the industry will present the up-to-date progress and readiness of EUV technology in each area of expertise, which include resist, mask, OPC, scanner, track, and wafer process integration. Remaining critical issues will be assessed also accordingly. Though EUV gets the upper hand nowadays, still other technologies are very active and show good progress. Therefore, this session will cover the update of the latest progress on alternative technologies such as nano imprint, directed self-assembly and computational lithography as well.
- Shangwon Kim (Dongbu HiTek)
- Seong-Sue Kim (Samsung Electronics)
- Jaehyun Kim (Dongjin Semichem)
- Hong Seok Kim (Toppan Photomasks Korea)
- Chang-Nam Ahn (ASML Korea)
- Hye-Keun Oh (Hanyang University)
- Changmoon Lim (SK hynix)
- Jaesung Choi (ASML Korea)
*상기 일정은 사전 안내 없이 변경될 수 있습니다.
* 발표 자료는 당일 컨퍼런스 종료 후 사이트를 통해 배포됩니다 (연사가 동의하지 않는 경우는 배포되지 않음).