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Programs Catalog

Programs Catalog

Technology Room 301, COEX Friday, February 02
1:00pm to 5:00pm
Standards SEMI Korea Office Friday, February 02
2:00pm to 4:00pm

아젠다

1.0    Welcome / Call to Order

  • 1.1    Introductions
  • 1.2    Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
  • 1.3    Agenda Review

2.0    Review and Approval of Previous Meeting Minutes

3.0    Liaison Report

  • 3.1    Japan FPD Metrology Committee
  • 3.2    Taiwan FPD Metrology Committee
  • 3.3    Staff Report

4.0    Ballot Review

  • 4.1    5633D (New Standard, Test Method for Viewing Angle Characteristic using Mixed Color on Visual Displays)
  • 4.2    5634C (New Standard, Test Method for Color Reproduction and Perceptual Contrast of Displays)

5.0    Subcommittee & Task Force Reports

  • 5.1    Perceptual Viewing Angle TF
  • 5.2    Perceptual Image Quality TF
  • 5.3    Transparent Display TF

6.0    Old Business

  • 6.1 Standards Document Development Project Period Review

7.0    New Business 

8.0    Action Item Review

9.0    Next Meeting and Adjournment

 

 

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Standards Room 305, COEX Thursday, February 01
10:00am to 12:00pm

아젠다

1.0    Welcome / Call to Order

  • 1.1    Introductions
  • 1.2    Meeting Reminders (Membership Requirement, Antitrust and Intellectual Property Reminders, Effective Meeting Guidelines)
  • 1.3    Agenda Review

2.0    Review and Approval of Previous Meeting Minutes

3.0    Liaison Report

  • 3.1    Japan chapter of I&C Technical Committee
  • 3.2    North America chapter of I&C Technical Committee
  • 3.3    Taiwan chapter of I&C Technical Committee

4.0    Staff Report

5.0    Ballot Review

  • 5.1    5832 (New Standard, Specification for Generic Counter Model)

6.0    Subcommittee & Task Force Reports

  • 6.1    GEM300 TF
  • 6.2    DDA TF
  • 6.3    ABFI TF  

7.0    Old Business  

  • 7.1   Previous Action Item Review

8.0    New Business

9.0    Action Item Review

10.0  Next Meeting and Adjournment

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Networking Room 402, COEX Thursday, February 01
5:20pm to 6:30pm

MI 리셉션은 MI(Metrology & Inspection)분야에 관련된 국내외 기술 전문가들이 한자리에 모여 최신 기술을 교류 뿐 아니라 네트워킹 기회를 얻을 수 있는 자리입니다. 

  • 날짜: 2018년 2월 1일 목요일
  • 시간: 17:20 - 18:30
  • 장소: 코엑스 4층 402호 앞
  • 대상: MI 포럼 참석자 + 사전 초대자

Contact

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Technology Room 402, COEX Thursday, February 01
10:00am to 5:20pm

As device technology shrinks to sub-10 nm, we expect a lot of challenges in process integration. Thus, many chip makers are considering EUV lithography to mitigate process risk and to reduce process integration time. However, EUV lithography also has many technical challenges. On the other hand, 3D memory process also brings another technical issue in many aspects. Therefore, we believe the role of Metrology & Inspection is getting more and more important to enable sub-10nm and 3D device.

This year, celebrating its 10th anniversary, MI Forum will cover the theme as “MI: An Enabler of Future Devices” with technical experts from worldwide. We hope you can get better understanding on MI challenges and solutions for upcoming process technologies in the forum and build the network with industry leaders in MI Networking reception, which will be held after the forum as well.

 

  • 날짜: 2018년 2월 1일 (목)
  • 시간: 10:00-18:30
  • 장소: 코엑스 4층 402호
  • 주제: MI: An Enabler for Future Devices
  • 언어: 영어, 한국어 (동시통역 제공되지 않음)

 

Committee

  • Chuck Kim (AMETEK Korea)
  • Chang Woo Kim (KLA-Tencor Korea)
  • TK Kim (Semilab Korea)
  • Harris Kim (Rudolph Technologies Korea)
  • Munhong Ro (Dongbu HiTek)
  • Changman Moon (NOVA Measuring Instruments Korea)
  • Byong Chon Park (KRISS)
  • Dong Chun Lee (Nanometrics Korea)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials Korea)  
  • Sung Hun Lee (Thermo-Fisher MSD Korea)
  • Junwoo Lee (Auros Technology)
  • Jason Jeong (Nextin)
  • Jaesung Choi (ASML Korea)

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 200,000 원 240,000 원 120,000 원
현장등록 240,000 원 280,000 원 150,000 원

 

아젠다

 10:00-10:10
  Welcome
   
 10:10-10:50
  Keynote
    Tuyen K. Tran, Intel
   
 Session 1: EUV
 10:50-11:20
   
 11:20-11:50   Metrology & inspection technology to achieve holistic lithography of EUV & 3D chips
  ASML
   
 11:50-12:30   EUV Reticle Management: From Mask Shop to Fab
  Moshe Preil, KLA-Tencor
   
 12:30-13:00
  TBD
  Philippe Leray, Imec (invited)
   
 13:00-14:30
  Lunch
  (Lunchbox will be provided to attendees.)
   
 Session 2: 3D
 14:30-15:00
  TBD
  Nanometrics
   
 15:00-15:30
   
 15:30-16:20
  Break
   
 15:50-16:20
  Near Line Analysis Solution for 3D NAND
  Jack Hager, ThermoFisher Scientific
   
 16:20-16:50
  OCD is addressing current and future 3D challenges
  Igor Turovets, NOVA Measuring Instruments
   
 Session 3: Collaboration
 16:50-17:20   MI Challenges for Future Devices
  Seong-Min Ma, SK hynix (invited)
   
 17:20-18:30
  (Forum attendees are invited to networking reception.)
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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STS Room 307, COEX Wednesday, January 31
1:00pm to 6:00pm

Advanced Lithography session of the STS 2017 will offer the opportunities to review the latest trends in the mainstream lithography technologies under the theme of "EUV High Volume Manufacturing and Beyond".

Recently there are a lot of progresses achieved in EUV and as a result EUV is getting considered as a manufacturing means more seriously than before. For the sake of the solid migration to the manufacturing phase, the readiness of each component of EUV will be reviewed during this meeting including overview, exposure tools, optics, material, mask, and process by the prominent leading figures of the corresponding area. In addition, the next generation EUV technologies like high-NA EUV and EUV double pattering will be discussed to disclose the potential issues and to prepare collaboratively throughout the industry.

 

  • 날짜: 2018년 1월 31일 (수)
  • 시간: 13:00-18:00
  • 장소: 코엑스 3층 307호
  • 주제: EUV High Volume Manufacturing and Beyond
  • 언어: 영어 (동시통역 제공되지 않음)

 

Committee

  • Shangwon Kim (Dongbu HiTek)
  • Seong-Sue Kim (Samsung Electronics)
  • Jaehyun Kim (Dongjin Semichem)
  • Hong Seok Kim (Toppan Photomasks Korea)
  • Chang-Nam Ahn (ASML Korea)
  • Hye-Keun Oh (Hanyang University)
  • Changmoon Lim (SK hynix)
  • Jaesung Choi (ASML Korea)

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 13:00-13:40
 
 
 13:40-14:20
  TBD
  Imec (invited)
 
 
 14:20-14:40
  TBD
  Andrew Grenville, Inpria
 
 
 14:40-15:00
 
 
 15:00-15:20
  Break
 
 
 15:20-16:00
 
 
 16:00-16:20
 
 
 16:20-16:40
 
 
 16:40-17:00
  Break
 
 
 17:00-17:20
 
 
 17:20-17:40
 
 
 17:40-18:00
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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STS Room 308, COEX Wednesday, January 31
1:00pm to 5:00pm

In this session, we will be able to share the most up-to-date research and development results in the field of Advanced Materials and Process Technology which are the key enablers of the future semiconductor devices. Many prominent authors from the academia and industries will cover various functional materials research area and semiconductor devices not only in the view point of the fundamental but also for the mass production. Especially, topics regarding material innovation for semiconductor application will be highlighted and technical challenges for mass production will be discussed. Excellent 8 presentations including 3 outstanding invited talks will be given and will cover the major technical issues and the leading edge solutions.

 

  • 날짜: 2018년 1월 31일 (수)
  • 시간: 13:00-17:00
  • 장소: 코엑스 3층 308호
  • 주제: Advanced Materials & Technologies for Future Semiconductor Devices 
  • 언어: 영어 (동시통역 제공되지 않음)

 

Committee

  • Si Bum Kim (MagnaChip Semiconductor)
  • Hyoungyoon Kim (Dongbu HiTek)
  • Jae Sung Roh (Yonsei University)
  • Kiseon Park (SK hynix)
  • Hyun Chul Sohn (Yonsei University)
  • Gill Lee (Applied Materials)
  • Marco Lee (Lam Research Korea)
  • Jong Min Lee (Eugene Technology)
  • In Gon Lim (Digital Imaging Technology)
  • HanJin Lim (Samsung Electronics)
  • Ji Hyun Choi (Tokyo Electron Korea)

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 13:00-13:40   TBD

  Prof. Sayeef Salahuddin, UC Berkeley (invited)
   
 13:40-14:00
  Emerging of Memory and Logic Process Technology: Epitaxy
  Oh Hyun Kim, SK hynix
   
 14:00-14:20
   
 14:20-14:40
   
 14:40-15:00   Break
   
 15:00-15:40
  Area-selective Atomic Layer Deposition of SiO₂ and Ru for Self-aligned Fabrication
  Prof. Adrie Mackus, Eindhoven University of Technology (invited)
   
 15:40-16:00
   
 16:00-16:40
  HfO2 Ferroelectric
  Prof. Akira Toriumi, University of Tokyo (invited)
 
 
 16:40-17:00
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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STS Room 317, COEX Wednesday, January 31
1:00pm to 4:50pm

Semiconductor scaling is becoming increasingly challenging, requiring more than mere conventional dimension scaling. Two different approaches can be taken at this moment. One approach is to find new specific applications, such as automotive and IoT, based on the current technology. Another approach is to use innovative device structures to overcome the limitations of the current structure. This session will discuss such challenges and the exciting future that lies ahead with distinguished 6 speakers from all of the world.

 

  • 날짜: 2018년 1월 31일 (수)
  • 시간: 13:00-16:50
  • 장소: 코엑스 3층 317호
  • 주제: Challenges to Future Device Technology
  • 언어: 영어 (동시통역 제공되지 않음)

 

Committee

  • Oh-Kyong Kwon (Hanyang University)
  • Dong-Won Kim (Samsung Electronics)
  • Tae Kyun Kim (SK hynix)
  • Rock-Hyun Baek (POSTECH)
  • Changhwan Shin (University of Seoul)
  • Sang Gi Lee (Dongbu HiTek)
  • Hi-Deok Lee (Chungnam National University)
  • Min Gyu Lim (MagnaChip Semiconductor)
  • Byung Jin Cho (KAIST)
  • Woo Young Choi (Sogang University)
  • Sung Woo Hwang (Samsung Advanced Institute of Technology)

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 13:00-13:40
   
 13:40-14:10
  TBD
  Namsung Kim, Applied Materials
   
 14:10-14:40
  TBD
  Samsung Electronics
   
 14:40-15:00   Break
   
 15:00-15:40
  Hans Mertens, imec (invited)
   
 15:40-16:20
  Negative Capacitance FET
  Prof. Asif Islam Khan, Georgia Tech (invited)
   
 16:20-17:00
  TBD
  Sooman Seo, SK hynix
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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STS Room 307, COEX Thursday, February 01
1:00pm to 5:30pm

These days the semiconductor business is expanding more rapidly since Big Data and AI (Artificial Intelligence) technologies need plenty of chips as well as processor chips. Two technologies become the most promising ones for the future industry and they will change fundamentally the industrial structure and our normal lives all over the world. The skyrocketing needs for memories makes all chip makers to focus on scale down current DRAM, VNAND new memories. In addition, the high performance processors needs also more scale downed logic chips. As the scaling down is continuing, dry etching technology will confront the process limit eventually so it is the right time to discuss about the new etch technologies for overcoming the limit in this annual SEMICON symposium.

We prepared deep and wide touching on the critical and key etch technologies like new Pulsed Etch, ALE (Atomic Layer Etch), Ultra-high Energy Ion Etch, very-Low Temp. Etch and Etch Simulation technologies. These are essential technologies for solving the scaling down issue and, furthermore, for Big Data and AI era. We invited the academia and industry expertise who can share the vision and solutions for next generation etching technologies- please join us to gain keen insight of future.

 

  • 날짜: 2018년 2월 1일 (목)
  • 시간: 13:00-17:30
  • 장소: 코엑스 3층 307호
  • 주제Novel Plasma Process Technologies for Next Generation Devices
  • 언어: 영어 (동시통역 제공되지 않음)

 

Committee

 

  • Jaesoung Kim (Dongbu HiTek)
  • Gyoungjin Min (Lam Research Korea)
  • Jongchul Park (Samsung Electronics)
  • Jong Won Shon (ASM Genitech)
  • Geun Young Yeom (Sungkyunkwan University)
  • Minsuk Lee (SK hynix)
  • IC Jang (Lam Research Korea)

 

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 13:00-13:40
 
 
 13:40-14:10
  TBD
  Ying Zhang, Applied Materials
 
 
 14:10-14:50
 
 
 14:50-15:20
 
 
 15:20-15:40
  Break
 
 
 15:40-16:00
 
 
 16:00-16:40
 
 
 16:40-17:10
  Data-based Etching Simulation and Diagnosis
  Jungsik Yoon, NFRI (invited)
 
 
 17:10-17:30
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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STS Room 308, COEX Thursday, February 01
1:00pm to 5:10pm

Continuous shrinkage of device dimension to nm level requires new materials and novel device structure which demand a new paradigm in contamination control and planarization to improve the production yield and device reliability. CFM technology has become more critical in device manufacturing below 20 nm devices. Film loss-free and damage free cleaning technology face severe challenges for next-generation device fabrication. Also, CMP has grown to be one of the essential technologies for advanced node device fabrications such as FinFET, III/V materials and V-NAND. 7-nm logic technology is already under developing now, and CMP will play the leading role on patterning for sub-7 nm FEOL and MOL process steps. To overcome the new CMP challenges, the consumables should play a more critical role. The purpose of this session is to increase the level of understanding on current and future CFM/CMP technology. 

 

  • 날짜: 2018년 2월 1일 (목)
  • 시간: 13:00-17:10
  • 장소: 코엑스 3층 308호
  • 주제:  CMP & Cleaning for Emerging Technology
  • 언어: 영어 (동시통역 제공되지 않음)

 

Committee

  • Kyunghyun Kim (Samsung Electronics)
  • Sang Yong Kim (Korea Polytechnics)
  • Ho Youn Kim (Dongbu HiTek)
  • Jin-Goo Park (Hanyang University)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Kyungho Hwang (SK hynix)

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원
 
Co-organized by   Korea CMP UGM
  Korea Surface Cleaning UGM (KSCUGM)

 

아젠다

 Session 1: CFM Technology
 
 13:00-13:40
   
 13:40-14:10
   
 14:10-14:30
   
 14:30-14:50
TBD
Keebum Kim, KLA-Tencor
   
 14:50-15:10 Break
   
 Session 2: CMF Technology
 
 15:10-15:50
   
 15:50-16:10
   
 16:10-16:30
   
 16:30-16:50
TBD
Sidney P. Huey, Applied Materials
   
 16:50-17:10

 

*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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STS Room 317, COEX Thursday, February 01
1:00pm to 6:25pm
As packaging, wafer level and heterogeneous system assembly in general, electronic systems for future mobility, 5G, AI and Automotive are targeting to find solutions for those key critical aspects of packaging: Performance, Flexibility and Cost competitiveness. Those solutions will make huge connection among system and system such as sensor and logic, logic and memory, antenna and logic. So we are expecting to make a new vision era how packaging as a SIP, FOWLP, 3D IC, and 2.5D IC will open to new market as a heart of 4th industry generation. To address those, chip-packaging-system interaction needs to be better understood. The experts of device design, FABs engineering, packaging, and system need to move closer together. Materials and Equipments need to be developed and tested for electronic systems. Those are the challenging but this session is helping to share the recent advanced packaging information.

 

  • 날짜: 2018년 2월 1일 (목)
  • 시간: 13:00-18:25
  • 장소: 코엑스 3층 317호
  • 주제: Advanced Packaging in a New Era
  • 언어: 영어 (통시통역 제공되지 않음)​​

 

Committee

  • Gu Sung Kim (Kangnam University)
  • Young Bae Park (Andong National University)
  • Min Suk Suh (SK hynix)
  • Hogeon Song (Samsung Electronics)
  • WS Shin (ASE Korea)
  • Seh Kwang Lee (Ehwa Diamond)
  • Hanchoon Lee (Dongbu HiTek)
  • Ji Young Chung (Amkor Technology Korea)
  • Soon Jin Cho (Samsung Electro-Mechanics)
  • Taeje Cho (Samsung Electro-Mechanics)
  • CS Han (ASE Korea)

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 13:00-13:30
  TBD
  Santosh Kumar, Yole Development
 
 
 13:30-14:00
  Challenges and Opportunities in Advanced Package of Automotive Electronics.
  Seungwook Yoon, StatsChipPAC
 
 
 14:00-14:20
  TBD
  Seunghyun Chae, SK hynix
 
 
 14:20-14:40
  Next Generation Fan-Out Technology
  Young Rae Kim, Amkor Technology
 
 
 14:40-15:00
  Break
 
 
 15:00-15:30
  TBD
  Charlie Cha, NVIDIA Korea (invited)
 
 
 15:30-15:55
  Strategies for Mechanically Reliable Thin Film Flexible Electronics
  Prof. Taek-Soo Kim, KAIST (invited)
 
 
 15:55-16:15
  Electrical Performance Analysis of RDL Interposer Package
  Se-Ho You, Samsung Electronics
 
 
 16:15-16:35
  Characterization Results from an Ion Beam Source for RDL Pre-Clean in Fan-Out Wafer and Fan-Out Panel
  Level Packaging
  Paul F. Werbaneth, Intevac
 
 
 16:35-16:55
  Break
 
 
 16:55-17:25
  Packaging Integration of 60GHz Antenna Array Using Silicon to Package Co-design Flow
  Marcel Wieland, GLOBALFOUNDRIES (invited)
 
 
 17:25-17:45
  TBD
  ASE
 
 
 17:45-18:05
  Panel Level Fan-out Technology
  Jeongsoo Byun, Samsung Electro-mechanics
 
 
 18:05-18:25
  Via-frame Fan-out WLP Technology as Packaging Solution for Smart Things
  Tae-Hoon Kim, nepes
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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SMART Room 402, COEX Wednesday, January 31
2:00pm to 5:30pm
반도체 시장을 이끌어갈 새로운 어플리케이션으로 Connected Car, 자율주행 시스템, 차량용 인포테인먼트 등을 포함하는 Smart Automotive가 부각되고 있으며, 이와 동시에 자동차 시장에서 반도체가 차지하는 비중 역시 높아지고 있습니다. 2030년을 목표로 완전한 자율주행차를 실현하기 위해서는 자동차 업계의 노력뿐만 아니라 반도체 업계의 노력이 수반되어야 합니다. 본 포럼에서는 다가올 Smart Automotive에서의 반도체의 역할과 이로 인해 변화될 우리의 새로운 SMART Driving에 대해서 알아보는 자리가 될 것입니다.
 
아젠다는 추후 공개 예정입니다.

 


Contact 

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SMART Room 301, COEX Thursday, February 01
1:00pm to 5:00pm
반도체 산업에서 바라보는 “스마트 제조”에 대한 시사점을 중심으로 기술 및 시장 동향에 대한 정보를 공유하는 자리입니다. Supply Chain 별로 데이터 중심의 자동화 된 솔루션 적용 사례 및 비전 발표를 통해 상호간의 새로운 협업 방안을 모색하고, 궁극적으로는 반도체 산업의 지속적인 발전을 가능하게 합니다. 
 
아젠다는 추후 공개 예정입니다. 
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Networking Room 403, COEX Wednesday, January 31
12:40pm to 1:30pm

사전에 초청된 분들만 입장이 가능합니다. 

 

  • 날짜: 2018년 1월 31일 수요일
  • 시간: 12:40-13:30
  • 장소: 코엑스 4층 403호 
  • 문의: semiconkorea@semi.org
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Keynotes Room 401, COEX Wednesday, January 31
10:00am to 12:40pm
연사 및 주제는 추후 공지될 예정입니다
 
  • 날짜: 2018년 1월 31일 (수)
  • 시간: 10:00-12:40
  • 장소: 코엑스 4층 401호
  • 언어: 영어 (동시통역 제공)
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Market Room 318, COEX Thursday, February 01
10:00am to 12:20pm

New application is rising- AI, Automotive in semiconductor industry and it is time to look it up for understanding its impact in semiconductor market. Also, China market is still interesting theme for our industry due to its potential and investment scale. You can explore these issues as well as semiconductor equipment and materials outlook in one place!

 

  • 날짜: 2018년 2월 1일 (목)
  • 시간: 10:00-12:20
  • 장소: 코엑스 3층 318호
  • 언어: 영어 (동시통역 제공되지 않음)
  • 대상
    • Senior Professionals in Marketing
    • Sales
    • Procurement
    • Business Development
    • Consulting and Product Planning
    • Finance

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 10:00-10:30   The Next Memory Cycle: When, Why, and How it will Happen
    Jim Handy, Objective Analysis
   
 10:30-11:00   The rise of China IC Industry
    Lung Chu, SEMI China
   
 11:00-11:20   Break
   
 11:20-11:50   Automotive Market and its Impact on Semiconductor
    Jim Feldhan, Semico Research
   
 11:50-12:20   Semiconductor Equipment and Materials Outlook
    Dan Tracy, SEMI
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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Networking Grand Ballroom, 5F, Grand InterContinental Seoul Parnas Wednesday, January 31
5:30pm to 8:00pm

400여 명의 전세계 반도체 반도체 리더 및 임원들이 한자리에 모이는 "인더스트리 리더십 디너"에서 네트워킹 기회를 누리시기 바랍니다. 행사의 원활한 운영을 위해 좌석이 지정되어 있으니, 초대된 분들께선 추후 안내드리는 사이트에서 사전에 RSVP를 해주시기 바랍니다.   

  • 날짜: 2018년 1월 31일 수요일
  • 시간: 17:30-20:00
  • 장소: 그랜드 인터컨티넨탈 서울 파르나스, 5층 그랜드 볼룸
  • 문의: semiconkorea@semi.org 

 

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Technology Room 318, COEX Wednesday, January 31
1:00pm to 5:10pm

The 5G and Big Data, key issues in next connected world are increasing demand for putting more pressure on test costs due to higher coverage requirements. Test must become smarter to address the increased quality demands, while at the same time remaining economical. To address these challenges, test industry is struggling with increasing instrumentation integration, smarter strategies, self-test, adaptive test, system-level test, as well as more sophisticated test hardware. In this Test Forum, you can get the clues to overcome these challenges from industry expertise.

 

  • 날짜: 2018년 1월 31일 (수)
  • 시간: 13:00-17:10
  • 장소: 코엑스 3층 318호
  • 언어: 영어, 한국어 (동시통역 제공되지 않음)

 

Committee

  • Young-Kwan Ko (UniTest)
  • James Jin-Soo Ko (Teradyne)
  • Kwonsung Ban (Samsung Electronics)
  • JeongBeom Bae (FormFactor Korea)
  • Sokyoung Song (SK hynix)
  • Kyu-hyuk Yeon (ASE Korea)
  • MinHo Chang (Amkor Technology Korea)
  • YH Jeon (TSE)
  • Jeongho Cho (Advantest Korea)

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

아젠다

 13:00-13:40
  TBD
  Yervant Zorian, Synopsys (invited)
   
 13:40-14:10
  5-Gen, RF Testing Solution
  Sungjong Park, Advantest
   
 14:10-14:40
   
 14:40-15:00   Break
   
 15:00-15:40
   
 15:40-16:10
   
 16:10-16:40
  TBD
  Ken Lanier, Teradyne
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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STS Room 307, COEX Thursday, February 01
9:00am to 11:45am

This short course tutorial is designed as basic course for new engineers who is working at etching technology related area. With the practical lecture from device makers, equipment suppliers and academia, you will learn the hottest issues and challenges in plasma & etching process and fundamental technologies as well.

 

  • 날짜: 2018년 2월 1일 (목)
  • 시간: 09:00-11:45
  • 장소: 코엑스 3층 307호
  • 언어: 한국어 (동시통역 제공되지 않음)

 

등록하기

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/24까지)
S4 함께 등록 시
100,000 원 120,000 원 50,000 원
80,000 원 100,000 원 30,000 원
현장등록
S4 함께 등록 시
120,000 원 150,000 원 80,000 원
100,000 원 120,000 원 50,000 원

 

아젠다

  09:00-09:45
  TBD
  Samsung Electronics
   
  09:45-10:00   Break
   
 10:00-10:45
  TBD
  Lam Research
   
 10:45-11:00   Break
   
 11:00-11:45
  TBD
  Prof. Geun Young Yeom, Sungkyunkwan University
 
*상기일정은 사전 안내 없이 변경될 수 있습니다. 
*발표자료는 현장에서 교재로 배부됩니다.
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