SungSoon Park has been a project leader at Amkor Technology Korea since 2016 with responsibility of Amkor Worldwide Technology Roadmap Management, Teardown Analysis and Technology/Market Analysis.
Prior to current position, he was dispatched to Amkor Headquarters (Chandler, AZ, USA) as a project manager. During his 3 years, he spent time managing new package development of FPFC (Fine Pitch Flip Chip) Cu pillar fcCSP, FCBGA and Silicon Photonics. He joined Amkor Technology Korea in 2000 as a R&D engineer of new package product development.
He received a M.S. degree in Physics from Hanyang University, Seoul, Korea.
Currently, he is a director of KMEPS (Korean Microelectronics and Packaging Society) and member of IEC (International Electrotechnical Commision: TC47, SC 47D).