CTO, Plasma Technology Business
Oxford Instruments Plasma Technology
MA Oxford Engineering Science 1975
MSc Electric Plasma, Oxford 1977
D Phil, Oxford ‘Properties of optically pumped discharges’ 1980
Member of the Institute of Engineering Technology; Chartered Engineer
Mike worked on pulsed plasma and metal CVD in an industrial research lab in the 1980’s, then spent three years as a university lecturer. He developed microwave plasma sources, and thin film etch and deposition processes in a competitor company.
Mike joined Oxford Instruments in 1992 as senior technologist, and is currently Chief Technology Officer at the Plasma Technology business. He was part of the development team for the 80+, 100, 300+, 400, Nanofab and FlexAl and Opal process modules for plasma etching, plasma enhanced chemical vapour deposition, and atomic layer deposition, and helped develop the ICP 65, ICP180, ICP380 and Cobra 300 plasma sources, the 15cm and 30cm ion sources, and the range of wafer tables including the cryo table and 1200C table. He is currently working on atomic layer etching.
He is currently responsible for product safety, intellectual property, and for collaboration projects. He is a co-inventor for five of OIPT’s patents. He was named an ‘Oxford Instruments Fellow’ in 2016.