Paul Werbaneth received the B.S. degree in chemical engineering from Cornell University, Ithaca, NY, USA, and recently completed studies in spoken Japanese from the Cornell Summer FALCON Program, and in marketing strategy, also through Cornell. He is Global Product Marketing Director at Intevac, Inc. Since entering the semiconductor industry in 1980 Paul has been a hands-on Photolithography Process Sustaining Engineer in an Intel wafer fab; a Senior Plasma Etch Process Engineer with Hitachi High Technologies; the Country Manager for Tegal Japan Inc.; the Vice President of Marketing and Applications at Tegal Corporation; a Business Development Manager at EV Group; and an independent consultant and writer.
Mr. Werbaneth is a member of the SEMI ASMC Steering Committee, and was the ASMC 2004 Conference Co-Chair. Paul is also a Guest Editor of IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, and has written an extensive number of articles, papers, and blogs regarding the semiconductor capital equipment business.
본 연사의 발표는 S6. Electropackage System and Interconnect Product(STS) 에서 볼 수 있습니다.