Taek-Soo Kim, Ph.D. joined the Department of Mechanical Engineering at KAIST in December 2010. Since then Kim has been directing Advanced Packaging and Thin Film Lab at KAIST (http://aptf.kaist.ac.kr). His research group focuses on mechanics-related subjects of advanced packaging and thin films: adhesion, deformation, fracture, fatigue, reliability, and stress/strain induced multiphysics phenomena. Kim received a BS degree in Mechanical Engineering in 2001 from Yonsei University, and MS and PhD degrees in Mechanical Engineering in 2006 and 2010, respectively, both from Stanford University.
본 연사의 발표는 S6. Electropackage System and Interconnect Product(STS) 에서 볼 수 있습니다.