Tae-Hoon Kim is Executive Vice President of nepes Corporation, nepes Corporation has succeeded in localizing key technologies that are essential for the semiconductor field. With a semiconductor portfolio involving bumping, WLP (Wafer Level Package), and FOWLP (Fan-Out WLP), nepes has become a company that identifies customer needs and meets them in the rapidly growing Mobile and IoT market.
He earned a Bachelor’s degree in Electronic Engineering from Korea University in 1988. Then, He joined Samsung Electronics in 1988 as a LSI chip design R&D engineer for development of PC chipset and up to now attended various projects related to business development of Samsung System LSI business. He has experienced in System LSI design, product planning, marketing and overseas business management in Japan and Europe. He led marketing team and product planning team in System LSI business unit in Samsung, steer 10 B$ business with major mobile players. In 2016, he joined nepes and is in charge on Global Marketing Unit.
본 연사의 발표는 S6. Electropackage System and Interconnect Product(STS) 에서 볼 수 있습니다.