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김영래

책임
앰코 테크놀로지 코리아

YoungRae Kim has been an engineer at Amkor Technology Korea for 6 years with responsibility for 2.5D TSV, and high-density fan-out package development. Currently, Kim is working on multi chip packaging development as a project manager.
Prior to joining Amkor, Kim was an engineer at Seoul TechnoPark. During his 3 years dedication at Seoul TechnoPark, Kim spent time doing responsibility for 3D wafer level package development.
Kim received a Master degree in material science from SeJong University, in Korea.

 

본 연사의 발표는 S6. Electropackage System and Interconnect Product(STS) 에서 볼 수 있습니다.

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