02-531-7800

Korean


S6. Electropackage System and Interconnect Product

Room 317, COEX Thursday, January 24
1:00pm to 5:20pm

Packaging Growth through Technology Diversification
 
Thanks to the semiconductor’s evolution, electronics markets are significantly expanded from the mainframe computing era to the mobile computing era. Today it is facing the 4th industry generation requires intelligence network in addition to performance excellence. For supporting this, every semiconductors area’s involvement, Design-Chip-Packaging-Test, is needed. Especially packaging technology’s flexibility and confrontation-ability will play a particularly important role with packaging as an Advanced-FOWLP using 3D IC and 2.5D IC, MEMS/Sensor, SIP, vertical integration package, and mature package’s advancing. It is challengeable. But this session will be helpful for understanding the new advanced packaging technologies.​
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 13:00-17:20
  • 장소: 코엑스 3층 317호
  • 언어: 영어 (동시통역은 제공되지 않습니다.)

 

Committee

  • Gu Sung Kim (Kangnam University)
  • Young Bae Park (Andong National University)
  • Min Suk Suh (SK hynix)
  • WS Shin (ASE Korea)
  • Seh Kwang Lee (Ehwa Diamond)
  • Hanchoon Lee (DB HiTek)
  • Ji Young Chung (Amkor Technology Korea)
  • Soon Jin Cho (Samsung Electro-Mechanics)
  • Taeje Cho (Samsung Electro-Mechanics)
  • Hwail Jin (Samsung Electronics)
  • HR Han (ASE Korea)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

    아젠다

     
     
     13:00-13:20
    The Latest Advanced Packaging Technology Trends
     
     
     
     13:20-14:00
    Evolution of Microstructure Signatures in Thermo-Mechanical Stressed Heterogeneously Integrated Components
     
     
     
     14:00-14:20
    High-Speed Serdes Package Development for Artificial Intelligence (AI) Applications
     
     
     
     14:20-14:40
    Break
     
     
     14:40-15:00
    TBD
     
    Rozalia Beica, DowDuPont
     
     
     15:00-15:20
    Testing & diagnosis of fine-pitch wafers and advanced packages
     
     
     
     15:20-15:40
    HBM Trends and Market Outlook
     
    MyeongJae Park, SK hynix
     
     
     15:40-16:00
    Break
     
     
     16:00-16:20
    TBD
     
    TBD, ASE
     
     
     16:20-16:40
    Challenges and Opportunities in 5G mmWave Packaging
     
    SeungWook Yoon, STATS ChipPAC
     
     
     16:40-17:00
    Agile Manufacturing of Glass Carriers for Fan-Out Packaging
     
     
     
     17:00-17:20
    Various Bonding Process for FO Technology in WLP and PLP
     
    Eric NG Hoi Ping, ASM Pacific Technology
       
    *상기일정은 사전 안내 없이 변경될 수 있습니다. 
    *발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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