02-531-7800

Korean


S4. Plasma Science and Etching Technology

Room 307, COEX Thursday, January 24
1:00pm to 6:10pm

Plasma Etch Process Technologies for Next Generation Devices
 
The semiconductor business is exploded in this year and the need for semiconductor chips will be more increased in the future by the explosive increase of big data, AI chips and autonomous vehicles. But there exist many limitations at the fabrication of the next generation chips and especially the plasma etching technology will confront the severe limitation. The most critical problems at the plasma etching process have been always related with etch loading, selectivity and variation at the more shrinked patterns and the problem is that there is no plasma etchers to provide the sufficient capability at the next generation. To overcome those limitations we must developed efficient vacuum system, plasma and process simulation S/W as well as high performance plasma etcher including ALE, IBE(Ion beam etch) and ultra low temperature etch. Especially the ALE, IBE and ultra low temperature etch technologies emerged as the very promising ones for replacing the conventional etchers, and those provide unique etch characteristics for the next generation devices fabrication.
We invited the specialists on the above technical areas from worldwide and we will provide the good chances to get the insight on the next generation etch technologies at this symposium. We wish that the coming symposium will contribute to the expansion of the future technologies for overcoming the limitation on the next generation devices fabrication.
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 13:00-18:10
  • 장소: 코엑스 3층 307호
  • 언어: 영어 (동시통역은 지원되지 않습니다.)
 

Committee

  • Jaesoung Kim (DB HiTek)
  • Gyoungjin Min (Lam Research Korea)
  • Jongchul Park (Samsung Electronics)
  • Jong Won Shon (ASM Genitech)
  • Geun Young Yeom (Sungkyunkwan University)
  • Minsuk Lee (SK hynix)
  • IC Jang (Lam Research Korea)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원

 

    아젠다

     
     
     13:00-13:40
    Etch Process Technology for Emerging Semiconductor Applications
     
     
     
     13:40-14:00
    Finding Correlation between RCP and Profile in HARC Etching through Simulation
     
     
     
     14:00-14:20
    Emerging memories: Etching Challenges and Solutions
     
     
     
     14:20-14:40
    Enabling 3D and High-Aspect Ratio Etch Technologies Through on-Chamber Process Vacuum
     
     
     
     14:40-15:00
    Break
     
     
     15:00-15:30
    A Precise Measurement Method of Plasma Density in Plasma Process
     
     
     
     15:30-16:00
    Semiconductor Manufacturer's View and Entreaty to Future Dry Etching Technologies
     
     
     
     16:00-16:20
    Process Variation Studies and the Impact on Electrical Performance
     
     
     
     16:20-16:40
    Break
     
     
     16:40-17:20
    DRIE / Silicon Ultra Low Temperature Plasma Etching: …Its Applications, Limitations & Evolution
     
    Mohamed Boufnichel, ST Microelectronics (invited)
     
     
     17:20-17:40
    Ion Beam Etching in Semiconductor Process
     
    Keun Hee Bai, Samsung Electronics
     
     
     17:40-18:10
    Optimizing Tools for ALD and ALE
     
    Mike Cooke, Oxford Instruments Plasma Technology
     
     
    *상기일정은 사전 안내 없이 변경될 수 있습니다. 
    *발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
    Sponsored by: 
    Share page with AddThis