02-531-7800

Korean


Metrology and Inspection 포럼

Room 402, COEX Thursday, January 24
10:00am to 7:00pm

New Waves: Ready to Enjoy?
 
The new waves of industry 4.0 is coming and the role of metrology and inspection is getting more and more important to enable it. To enjoy these waves, we need to prepare the new technologies and sources accordingly in a timely manner. With excellent 10 presentations from technology experts, you can get better understanding on MI challenges and solutions we’re facing now and near future and build the strong network with industry leaders.
 
  • 날짜: 2019년 1월 24일(목)
  • 시간: 10:00-19:00
  • 장소: 코엑스 4층 402호
  • 언어: 영어, 한국어 (동시통역은 지원되지 않습니다.)
 

Committee

  • Chuck Kim (AMETEK Korea)
  • Chang Woo Kim (KLA-Tencor Korea)
  • TK Kim (Semilab Korea)
  • Harris Kim (Rudolph Technologies Korea)
  • Munhong Ro (DB HiTek)
  • Changman Moon (NOVA Measuring Instruments Korea)
  • Byong Chon Park (KRISS)
  • Hyungwon Yoo (Hitachi High-Technologies Korea)
  • Byoung-Ho Lee (SK hynix)
  • Suk Woo Martin Lee (Applied Materials Korea)   
  • Sung Hun Lee (Thermo Fisher Scientific Electron Microscopy Korea)
  • Dongchul Ihm (Samsung Electronics)
  • Hyunjin Chang (Auros Technology)
  • Jason Jeong (Nextin)
  • Jaesung Choi (ASML Korea)

 

등록비

  SEMI 회원사 비회원사 학생
사전등록(1/16까지) 200,000 원 240,000 원 120,000 원
현장등록 240,000 원 280,000 원 150,000 원

 

아젠다

 
 
10:00-10:10
Welcome
 
 
10:10-10:40
Keynote
 
Metrology and Inspection: Challenges, Opportunities and Requirements for Advanced Logic Technology
 
 
 
 
 
Session 1: Industry 4.0
 
 
10:40-11:10
TBD
 
Intel
 
 
11:10-11:40
A Systematic Approach to Integrate Metrology and Inspection
 
Poh-Boon Yong, KLA-Tencor
 
 
11:40-12:10 TBD
  TBD
   
12:10-13:30
Lunch
 
 
13:30-14:00
Tilt, Overlay and Hole Shape using Spectrum Analysis
 
Liu Zhuan, Nanometrics
 
 
14:00-14:30
Challenges in Enabling Multiple Feedback & Feedforward Loops for Advanced Patterning Control
 
Ofer Adan, Applied Materials
 
 
 
 
Session 2: New Sources
 
 
14:30-15:00
TBD
 
SK hynix
 
 
15:00-15:30
X-ray Dimensional Metrology for the Semiconductor Industry
 
 
 
15:30-15:50 Break
   
15:50-16:20
New OPC Modeling with HMI e-Beam System
 
Seung-Hyuk Lee, ASML
 
 
16:20-16:50
CDSEM Metrology of Line-Edge Roughness (LER) and Wiggling occurring in EUV-Lithography or Mandrel Process
 
 
 
16:50-17:20
Enabling EUV Materials Defectivity Qualification with Un-patterned Wafer Inspection
 
 
 
17:30-19:00
Networking Reception
 
(Forum attendees are invited to networking reception.)
 
 

*The agenda will be subject to change without notice.

 

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