S5. Contamination-free Manufacturing and CMP Technology

Room 308, COEX Thursday, January 24
1:00pm to 5:00pm

업데이트 예정

Continuous shrinkage of device dimension to nm level requires new materials and novel device structure which demand a new paradigm in contamination control and planarization to improve the production yield and device reliability. CFM technology has become more critical in device manufacturing below 20 nm devices. Film loss-free and damage free cleaning technology face severe challenges for next-generation device fabrication. Also, CMP has grown to be one of the essential technologies for advanced node device fabrications such as FinFET, III/V materials and V-NAND. 7-nm logic technology is already under developing now, and CMP will play the leading role on patterning for sub-7 nm FEOL and MOL process steps. To overcome the new CMP challenges, the consumables should play a more critical role. The purpose of this session is to increase the level of understanding on current and future CFM/CMP technology. 


  • 행사명: S5. Contamination-free Manufacturing and CMP Technology
  • 날짜: 2019년 1월 24일(목)
  • 시간: 13:00-17:00
  • 장소: 코엑스 3층 308호
  • 주제:  
  • 언어
  • 후원



  • Kyunghyun Kim (Samsung Electronics)
  • Sang Yong Kim (Korea Polytechnics)
  • Ho Youn Kim (DB HiTek)
  • Jin-Goo Park (Hanyang University)
  • Haedo Jeong (Pusan National University)
  • Hong, Chang-Ki (Versum Materials)
  • Kyungho Hwang (SK hynix)



  SEMI 회원사 비회원사 학생
사전등록(1/24까지) 150,000 원 180,000 원 80,000 원
현장등록 180,000 원 200,000 원 100,000 원
Co-organized by   Korea CMP UGM
  Korea Surface Cleaning UGM (KSCUGM)



     Session 1: CFM Technology
     14:40-15:00 Break
     Session 2: CMP Technology
    *상기일정은 사전 안내 없이 변경될 수 있습니다. 
    *발표자료는 연사동의를 받은 자료에 한하여 행사 이후 이메일로 다운로드 방법을 안내드립니다.
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